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Nitrogen adjusting device for semiconductor oven

An adjustment device and semiconductor technology, applied in the direction of drying gas arrangement, drying, dryer, etc., can solve the problems of reducing the internal temperature of the oven, the poor effect of semiconductor drying, and reducing the drying quality of the oven, so as to improve the drying efficiency. Effect, anti-oxidation effect

Inactive Publication Date: 2020-11-17
JILIN AGRICULTURAL UNIV
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  • Application Information

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Problems solved by technology

[0004] The above-mentioned patent also has the following disadvantages: when introducing nitrogen gas into the oven, the temperature of the newly released nitrogen gas is low, which will reduce the temperature inside the oven, resulting in poor drying effect of semiconductors, which cannot be well processed. The semiconductor is dried, which reduces the drying quality of the oven

Method used

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  • Nitrogen adjusting device for semiconductor oven
  • Nitrogen adjusting device for semiconductor oven
  • Nitrogen adjusting device for semiconductor oven

Examples

Experimental program
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Embodiment 1

[0030] refer to Figure 1-4 , a semiconductor oven nitrogen regulating device, comprising a bottom plate 1, the top outer wall of the bottom plate 1 is provided with a nitrogen bottle 2, a heating box 4 and a drying box, and one side of the outer wall of the heating box 4 is fixed with an electronic air pump 13 by screws, and the electronic air pump The input end of 13 and the inner wall of one side of the heating box 4 are connected with the same third guide roller 12 through the flange, and the output end of the nitrogen cylinder 2 and the top inner wall of the heating box 4 are connected with the same first conduit 3 through the flange. And both sides of the inner wall of the heating box 4 are fixed with a heater 6 by screws, and the both sides of the inner wall of the drying box are fixed with an air jet disc 21 by screws, and one side of the outer wall of the air jet disc 21 is fixed with spray nozzles distributed equidistantly by screws. 19. The inclination angles of the...

Embodiment 2

[0038] refer to Figure 5 , a nitrogen regulating device for a semiconductor oven. Compared with Embodiment 1, this embodiment also includes a choke box 33 fixed to the inner wall of one side of the drying box by screws, and the top outer wall and the bottom outer wall of the choke box 33 are respectively provided with The air outlets 32 and the air inlets 31 are equidistantly distributed, and the inner wall of the choke box 33 is provided with equidistantly distributed choke passages 34 , and the choke passages 34 have a zigzag structure.

[0039] Connect the equipment to the power supply. First, open the nitrogen bottle 2 to introduce nitrogen gas into the heating box 4 through the first conduit 3, turn on the heater 6 and the motor 7, and the motor 7 drives the rotating rod 8 to rotate, and then the first stirring rod 9, the horizontal The rod 11, the stirring frame 24 and the arc rod 25 can evenly heat the nitrogen gas, turn on the electronic air pump 13, and introduce the...

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Abstract

The invention belongs to the technical field of semiconductor ovens, particularly relates to a nitrogen adjusting device for a semiconductor oven, and provides the following scheme for solving the problem that nitrogen is not heated. The nitrogen adjusting device comprises a base plate, a nitrogen cylinder, a heating box and a drying box are arranged on an outer wall of the top of the base plate,an electronic air pump is arranged on an outer wall of one side of the heating box, a same third guide roller is arranged at an input end of the electronic air pump and an inner wall of one side of the heating box, a same first guide pipe is arranged at an output end of the nitrogen cylinder and an inner wall of the top of the heating box, and heaters are arranged on two sides of the inner walls of the heating box. According to the device, the heater, the electronic air pump, the heating box, an air injection disc, a spraying nozzle, a fifth guide pipe, a fourth guide pipe, a first electromagnetic valve and a second electromagnetic valve are provided, and when a semiconductor is dried, the heater and the electronic air pump are started, and heated nitrogen is guided into the drying box sothat the semiconductor can be dried and the semiconductor can be prevented from being oxidized.

Description

technical field [0001] The invention relates to the technical field of semiconductor ovens, in particular to a nitrogen regulating device for semiconductor ovens. Background technique [0002] At present, during semiconductor production, semiconductor semi-finished products need to be dried, and semiconductor semi-finished products are extremely prone to oxidation when dried in the air. Therefore, during industrial production, nitrogen gas is added to the oven to prevent semiconductor semi-finished products from being oxidized. [0003] After searching, the Chinese patent authorization number is CN104896908B, which discloses a semiconductor oven nitrogen regulating device, including a box body, a front door, a bracket, an inner tank, an air inlet port, a nitrogen regulating valve, a fan, and a tray. [0004] The above-mentioned patent also has the following disadvantages: when introducing nitrogen gas into the oven, the temperature of the newly released nitrogen gas is low, ...

Claims

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Application Information

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IPC IPC(8): F26B21/14F26B21/00
CPCF26B21/001F26B21/14
Inventor 侯丽新顾洪军李士军周婧
Owner JILIN AGRICULTURAL UNIV
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