Lead frame and manufacturing method thereof

Abstract

The invention discloses a lead frame and a manufacturing method thereof. The method comprises the following steps: etching a first surface of a metal substrate for the first time to form a first etching groove, forming a through positioning hole by penetrating through the edge of the first surface; and filling the first etching groove with a first insulating material, turning over the metal substrate, positioning the position of the metal substrate through the positioning holes, etching the second surface of the metal substrate subsequently for the second time to form a second etching groove communicated to the first etching groove, and finally performing surface electroplating treatment. Therefore, according to the lead frame and the manufacturing method thereof, by means of the secondaryetching technology, under the isotropic characteristic of wet etching, the etching penetration distance can be reduced so as to reduce the overall size, the design that no metal pins exist on the four faces is achieved, and the problems of air tightness reduction and short circuit caused by exposure of the metal pins are reduced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing technology, in particular to a lead frame and a manufacturing method thereof. Background technique [0002] In the field of semiconductor manufacturing technology, the lead frame (also called lead frame) is used as the chip carrier of the integrated circuit. It is a kind of bonding material (gold wire, aluminum wire, copper wire, etc.) The electrical connection forms the key structural part of the electrical circuit. It acts as a bridge connecting the external wires. Most of the semiconductor integrated blocks need to use the lead frame, which is an important basic component in the electronic information industry. [0003] The existing lead frame manufacturing method is to use stamping process or etching process to process the metal substrate into a target preset shape, and then directly perform surface electroplating treatment on it, or first complete the package and then perform post-p...

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Problems solved by technology

[0004] If the lead frame is formed by the stamping process, it is impossible to make a more complex design like the etching process. Therefore, in terms of the density of the package arrangement, the stamped lead frame cannot be as dense as the etched lead frame, that is to say , not suitable for denser small-pitch products

[0005] If the lead frame is formed by etching process, because the front and back of the lead frame are etched with etching solution at the same time, the isotropic characteristics of wet etching make the etching distance too large, and the spacing between chips will be limited; in addition, this kind of There will be exposed metal pins on the four sides of the lead frame, which will increase the penetration path, reduce the overall airtightness, and cause a short circuit risk

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