Martensitic s free-cutting stainless steel

Abstract

The present invention relates to a martensitic S free-cutting stainless steel, which in mass % contains C: 0.08-0.70%, Si: 0.01-1.0%, Mn: 0.1-1.50%, S: 0.15-0.60%, P: 0.010 to 0.050%, Cr: 10 to 16%, N: 0.005 to 0.15%, Al: 0.004% or less, Mg: 0.0020% or less, O: 0.007 to 0.030%, Ni: 0 to 1.0%, Mo: 0 to 3.0% , and the remainder contains Fe and impurities; and contains (Mn, Cr)(S, O)-based inclusions containing 0.5 mass % or more of O.

Description

technical field [0001] The present invention relates to a martensitic S free-cutting stainless steel (Martensitic S-containing free-cutting stainless steel). [0002] This application claims priority based on Japanese Patent Application No. 2018-112652 for which it applied in Japan on June 13, 2018, and uses the content here. Background technique [0003] In parts such as OA equipment and electronic equipment, precision parts produced by cutting require high dimensional accuracy and good surface texture on the cut surface in addition to chip disposal during cutting. Materials that can meet these requirements include SUS420F containing 0.15% or more of S, or martensitic free-cutting stainless steel containing Pb, Se, and Te alone or in combination to further improve machinability (Patent Documents 1 to 3). [0004] On the other hand, martensitic free-cutting stainless steel containing Bi or Sn and in which a second phase mainly composed of Cu is dispersed has been proposed i...

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Problems solved by technology

[0005] However, with the inventions described in Patent Documents 1 to 5, no satisfactory results were obtained in terms of manufacturability or surface properties after cutting.

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