Radiating device, inverter and electronic equipment

A heat dissipation device and heat sink technology, which is applied in the transformation of equipment structural parts, modification of power electronics, conversion of irreversible DC power input to AC power output, etc., can solve the problem of attenuation of heat dissipation capacity, reduction of inverter power generation, etc. question

Inactive Publication Date: 2020-11-27
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional natural radiator is located at the back of the inverter chassis. When installed horizontally or inclined at a small angle on the roof or in fishing-solar complementary scen

Method used

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  • Radiating device, inverter and electronic equipment
  • Radiating device, inverter and electronic equipment
  • Radiating device, inverter and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

other Embodiment approach

[0081] In other embodiments, the materials of the heat conduction member 23, the main heat sink 21 and the extended heat sink 22 can also be the same, that is, the heat conduction coefficients of the heat conduction member 23, the main heat sink 21 and the extension heat sink 22 are the same, for example, the heat conduction member 23, the main heat sink 22 The radiator 21 and the extended radiator 22 can be copper or aluminum at the same time.

[0082] When the materials of the heat conduction element 23, the main heat sink 21 and the extension heat sink 22 are the same (that is, the thermal conductivity is the same), in order to increase the heat conduction effect of the heat conduction element 23, a phase change medium can also be arranged in the heat conduction element 23 to improve the thermal conductivity of the heat conduction element 23. thermal conductivity. Specifically, see Figure 8 , the heat conducting element 23 includes a cavity 235, and a phase change medium ( ...

other Embodiment approach

[0089] In other embodiments, the main heat sink 21 and the extended heat sink 22 may not be fixedly connected by a suspension. For example, the main base plate 211 is provided with a first mounting hole, and the extended base plate 221 is provided with a second mounting hole. A mounting hole and a second mounting hole are set correspondingly. During installation, the screws pass through the second mounting hole on the extension base plate 221 and the first mounting hole on the main base plate 211 in turn, so that the main heat sink 21 and the expansion heat sink 22 can be connected. The connection is disassembled, and due to the corresponding setting of the first mounting hole and the second mounting hole, the positioning installation of the main radiator 21 and the extended radiator 22 is realized, and the problems of tilting and unstable center of gravity of the radiator are avoided.

[0090] Similarly, the first mounting hole may be located at the edge of the main substrate ...

other Embodiment approach

[0099] In other embodiments, the heat conduction member 23, the main heat sink 21 and the extended heat sink 22 can all be split structures, and the heat conduction member 23 can be fixed to the main substrate 211 of the main heat sink 21 and the extended heat sink by plugging, bonding, etc. The flexible configuration of the main heat sink 21 and the extended heat sink 22 is realized on the extension substrate 221 of the heat sink 22.

[0100] The heat conduction element 23 and the extension base plate 221 and between the heat conduction element 23 and the main base plate 211 can be thermally connected directly, or an elastic member 27 can be arranged between the heat conduction element 23 and the extension base plate 221 and between the heat conduction element 23 and the main base plate 211 To improve heat dissipation efficiency. refer to Figure 9a, the elastic member 27 can be graphite foam, phase change film, thermal grease, thermal gel or liquid metal. One end of the he...

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PUM

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Abstract

The invention discloses a radiating device, an inverter and electronic equipment. The radiating device comprises a main radiator, an extension radiator and a heat conduction piece. The main radiator comprises a main substrate and main radiating teeth. One end of each main radiating tooth is connected to the main substrate; and the main radiating teeth are located at the ends, away from the main substrate, of the main radiating teeth, the extension radiator is detachably connected to the main radiator, and the heat conduction piece extends to the extension radiator from the main substrate so asto transfer heat between the main substrate and the extension radiator. The radiating device is designed to be of a split structure, the radiating capacity of the radiating device is improved throughthe dual radiating effect of the main radiator and the extension radiator, the radiating efficiency is improved, in addition, due to the fact that the extension radiator is detachably connected withthe inverter provided with the main radiator, flexible configuration is achieved, and the problem that transportation, installation and maintenance are difficult is solved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device, an inverter and electronic equipment. Background technique [0002] Photovoltaic inverters are mainly used to invert the direct current generated by photovoltaic panels into alternating current that can be connected to the grid, and can be applied to the ground (power station), roof (commercial and household) and water surface (commercial fishing and photovoltaic). The ground application is mainly installed vertically with brackets; the roof considers to avoid blocking the sunlight of the surrounding photovoltaic panels, and is generally installed at a small angle; the fishing light complementary water surface is generally installed on a floating body on the floating water surface, considering avoiding light blocking and stable center of gravity, generally horizontal Install. [0003] The application scene environment of photovoltaic...

Claims

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Application Information

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IPC IPC(8): H02M7/42H05K7/20
CPCH02M7/003H05K7/20909H05K7/209H05K7/20418H05K7/20409H05K7/20936
Inventor 孙发明李泉明陈君
Owner HUAWEI DIGITAL POWER TECH CO LTD
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