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Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film

A polyimide film and polyamic acid technology, which is applied in the fields of polyimide film, polyamic acid, polyamic acid solution, and polyimide, can solve the problems of component damage, substrate warpage, etc. Excellent thermal dimensional stability and transparency

Active Publication Date: 2020-11-27
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When electronic components mainly made of inorganic materials are formed on plastic film substrates, stress may be generated at the component forming interface due to the difference in thermal expansion coefficient between the inorganic material and the plastic film substrate, and warping of the substrate and destruction of the components may occur.

Method used

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  • Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film
  • Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film

Examples

Experimental program
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preparation example Construction

[0043] The preparation method of the polyamic acid solution containing imidazoles is not particularly limited. Imidazoles may be added to a polyamic acid solution obtained by polymerization of tetracarboxylic dianhydride and diamine in an organic solvent, or imidazoles may be added to a solution before or during the polymerization reaction. When imidazoles are contained in the reaction system, tetracarboxylic dianhydride may ring-open and the reactivity with diamine may fall. Therefore, the method of adding imidazoles to the polyamic-acid solution obtained by superposition|polymerization of tetracarboxylic dianhydride and diamine is preferable from a viewpoint of the molecular weight control of polyamic acid. The imidazoles may be directly added to the polyamic acid, or the imidazoles previously mixed with a solvent may be added to the polyamic acid.

[0044] Various organic or inorganic low-molecular or high-molecular compounds can be compounded in order to impart processabi...

Embodiment 1

[0087] 400.00 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 54.42 g of TFMB were put into a 2 L separable glass flask equipped with a stirrer equipped with a stainless steel stirring rod and a nitrogen introduction tube, and stirred until After the dissolution, stirring the solution, 25.00 g of BPDA, 16.68 g of PMDA, and 3.90 g of BPAF were added in this order, and stirred for 24 hours to obtain a polyamic acid solution. The input concentration of the diamine component and the tetracarboxylic dianhydride component in this reaction solution was 20.0 weight% with respect to the reaction solution whole quantity.

Embodiment 2

[0089]To 500 g of a 20.0% by weight polyamic acid solution synthesized in the same manner as in Example 1, 1 g of 1,2-dimethylimidazole (hereinafter sometimes referred to as DMI) was added (1 part by weight, 100 parts by weight of polyamic acid, The polyamic-acid solution was prepared with respect to 1 mol of amide groups of a polyamic acid (0.03 mol).

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Abstract

The polyamic acid according to the present invention, which is produced by a polyaddition reaction between a diamine and tetracarboxylic dianhydrides, contains 2,2'-bistrifluoromethylbenzidine as a diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride and 9,9'-(3,4'-dicarboxyphenyl)fluorenic dianhydride as tetracarboxylic dianhydride components. Preferably, the amount of 9,9'-(3,4'-dicarboxyphenyl)fluorenic dianhydride is 0.5-10 mol% inclusive relative to the total amount of the tetracarboxylic anhydrides.

Description

technical field [0001] The present invention relates to polyamic acid, polyamic acid solution, polyimide, and polyimide film. Furthermore, this invention relates to the laminated body and flexible device provided with the polyimide film. Background technique [0002] Electronic devices such as displays, solar cells, and touch panels are required to be thinner, lighter, and more flexible, and research is underway to use plastic film substrates instead of glass substrates. [0003] In the manufacturing process of these electronic devices, electronic components such as thin film transistors and transparent electrodes are arranged on the substrate. The formation of electronic components requires a high-temperature process, so the heat resistance that can adapt to the high-temperature process is required for the plastic film substrate. When electronic components mainly composed of inorganic materials are formed on plastic film substrates, the difference in thermal expansion coe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08K5/3445C08L79/08H01L51/50H05B33/02H05K1/03
CPCC08J5/18C08K5/3445C08L79/08H05B33/02H05K1/03C08G73/1014C08G73/1032C08G73/1067C08J2379/08B32B27/08B32B27/281H01L27/1218
Inventor 宇野真理
Owner KANEKA CORP
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