Rapid forming device and system for ultra-high molecular weight polymer and control method of rapid forming system
An ultra-high molecular weight, molding device technology, applied in manufacturing auxiliary devices, additive manufacturing, manufacturing tools, etc., can solve the problems of narrow processing temperature range, limited application occasions, and poor fluidity of ultra-high molecular weight polymers, and achieve printing and molding structures. Flexible, adaptable to a large temperature range and strong environmental adaptability
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Embodiment 1
[0089] like Figure 1 to Figure 5 As shown, a rapid prototyping device 1 for ultra-high molecular weight polymers described in this embodiment includes a silo 2, and a chamber for containing ultra-high molecular weight polymers is arranged inside; The bottom of the silo 2; the feeding rod 4 is arranged to be able to extend into or out from the top of the silo 2, for extruding the molten ultra-high molecular weight polymer from the nozzle 3 out of the silo 2; The heating module 5 is formed from the top of the silo 2 to the side of the bottom nozzle 3, and the temperature gradually increases.
[0090] Wherein, the heating area is divided into a first heating area 501, a second heating area 502 and a third heating area 503 in turn from the top to the bottom side of the silo 2; The ultra-high molecular weight polymer is in the original state when it is put into the silo 2; the ultra-high molecular weight polymer in the second heating zone 502 is in the transition state from the o...
Embodiment 2
[0092] like Figure 1 to Figure 5 As shown, this embodiment is based on the above-mentioned Embodiment 1. In the rapid prototyping device 1 for ultra-high molecular weight polymers described in this embodiment, the heating range of the first heating zone 501 is the same as the heating range of the second heating zone 501. The ratio of the sum of the heating ranges of the heating area 502 and the third heating area 503 is between 1:3 and 1:1; the heating range ratio of the second heating area 502 and the third heating area 503 is between Between 1:5 and 1:1.
Embodiment 3
[0094] like Figure 1 to Figure 5 As shown, this embodiment is based on the above-mentioned first or second embodiment, the heating module 5 in this embodiment is a heating wire matched with the silo 2; the heating temperature of the heating module 5 is 100°C to between 450°C.
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