Hot-melt sealant film and preparation method thereof
A technology of hot-melt sealing and hot-melt adhesive layer, which is used in chemical instruments and methods, household seals, flat products, etc. Insufficient adhesive strength on the back side, to achieve the effect of low production cost, high material utilization rate and good storage performance
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[0027] The invention provides a preparation method of a hot-melt sealant film, comprising the following steps:
[0028] The hot-melt adhesive layer material, the base layer material and the back adhesive layer material are multi-layered co-extruded to obtain a hot-melt sealant film; the hot-melt sealant film includes a base layer and a hot-melt sealant respectively disposed on both sides of the base layer. Adhesive layer and backside adhesive layer.
[0029] In the present invention, the hot-melt adhesive layer material is a first copolymer, and the first copolymer is preferably an EVA (ethylene-vinyl acetate copolymer) material with a VA (vinyl acetate) content of 23-52 wt%, More preferably, it is an EVA material with a VA content of 30-50wt%; the melting point of the first copolymer is preferably 45-72°C, more preferably 50-70°C, and the melting index is preferably 18-180g / 10min, more preferably 25 to 150 g / 10min, more preferably 50 to 80 g / 10min. In the present invention,...
Embodiment 1
[0053] The three-layer structure of hot-melt adhesive layer, base layer and back adhesive layer is adopted. The hot-melt adhesive layer is made of EVA material with VA content of 30wt%, melting point of 50°C and melt index of 50g / 10min; the base layer is made of polyethylene copolymer. Mixed modified material, the preparation method is as follows: using low-density polyethylene and linear low-density polyethylene materials according to the mass ratio of 25:75 to fully mix and evenly, and then put in a screw extruder for extrusion molding; the back adhesive layer is VA EVA material with a content of 18% and a melt index of 3g / 10min; wherein the mass fraction of the hot melt adhesive layer is 30%, the mass fraction of the base layer is 50%, and the mass fraction of the back adhesive layer is 20%.
[0054] Using three screw extruders, the hot-melt adhesive layer, the matrix layer and the back adhesive layer were respectively added to the three screw extruders for multi-layer co-ex...
Embodiment 2
[0056] It adopts a three-layer structure of hot melt adhesive layer, base layer and back adhesive layer. The hot melt adhesive layer is made of EVA material with a VA content of 40%, a melting point of 55°C and a melt index of 65g / 10min; the base layer is made of EVA material. The preparation method of the ethylene-blended modified material is the same as that of Example 1; the back adhesive layer is an EVA material with a VA content of 18% and a melt index of 3g / 10min. Wherein, the mass fraction of the hot melt adhesive layer is 35%, the mass fraction of the base layer is 55%, and the mass fraction of the backside adhesive layer is 10%.
[0057] Using three screw extruders, the hot-melt adhesive layer, the base layer and the back adhesive layer were respectively added to the three screw extruders for multi-layer co-extrusion. The extrusion temperature of the hot-melt adhesive layer was 90 °C, and the The extrusion temperature of the layer was 150°C, the extrusion temperature ...
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