Semiconductor silicon wafer patch based on thermal winding technology

Abstract

The invention discloses a semiconductor silicon wafer patch based on a thermal winding technology, and belongs to the technical field of semiconductor silicon wafers. A first outer envelope layer canbe promoted to be peeled off from the outer side of a main magnetic ball by virtue of a counter-acting force, and meanwhile, a second outer envelope layer can be peeled off from the outer side of theexposed main magnetic ball under the attraction action. Reaction grinding balls in the second outer envelope layer are promoted to be exposed, the reaction grinding balls are promoted to react with air to release a large amount of heat, on one hand, air between the semiconductor silicon wafer and the patch can be exhausted by means of heat generated in the reaction process, and therefore the air amount in the semiconductor silicon wafer and the patch is reduced; on the other hand, by means of the attraction effect between ferroferric oxide powder generated after the reaction and the second outer envelop layer and the attraction effect of the second outer envelop layer on a lower inverted hook, an upper inverted hook and the lower inverted hook can be simulated into bristles and soft bristles of hook-and-loop fasteners; therefore, the connection strength between the semiconductor silicon wafer and the patch is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor silicon wafers, and more specifically, relates to a semiconductor silicon wafer patch based on thermal winding technology. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. , no matter from the perspective of technology or economic development, the importance of semiconductors is very huge. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. , common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in the application of ...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, during the process of bonding semiconductor silicon wafers, air bubbles are likely to appear between the patch and the semiconductor silicon wafer, thus making the bonding between the patch and the semiconductor silicon wafer weak, and at the same time, during use, Due to the increase in temperature, it may cause a bulge between the semiconductor silicon wafer and the patch

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