FPC product processing method
A product and connector technology, applied in the direction of coating non-metallic protective layer, printed circuit, flexible printed circuit board, etc., can solve the problems of long production cycle, affecting product reliability, high cost, etc., to reduce manufacturing cost, Avoid the phenomenon of tin melting, the effect of short production cycle
Active Publication Date: 2020-12-08
XIAMEN BOLION CIRCUIT
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Problems solved by technology
The conventional processing flow of this kind of FPC product is to etch the line - press the protective film - OSP - punch the shape - SMT soldering nickel sheet, NTC thermistor - press the outer protective film - press the connector reinforcement - SMT soldering connector , the process requires two furnace reflow soldering, long production cycle, low efficiency, and high cost. At the same time, the second furnace reflow soldering will remelt the solder paste of the first SMT soldering and produce tin melting phenomenon, which affects product reliability
In order to avoid the tinning problem caused by the secondary furnace, another solution is to use soldering machine welding or laser welding for the connector, but this requires single-chip processing and additional production equipment, and the process is long and inefficient
Both of these two schemes OSP (organic solder preservative) require secondary soldering. Since the OSP anti-oxidation layer has undergone multiple high-temperature processes during one-time SMT nickel sheet welding and pressing the outer protective film, OSP may be damaged, thus affecting the connection. soldering reliability
Method used
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[0034] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.
[0035] refer to Figure 1-8 , describing a method for processing figure 1 The FPC product 1 method shown. The method includes the following steps:
[0036] S1, etching circuit;
[0037] S2, paste the protective film;
[0038] S3. Reinforcing the pressure connector;
[0039] S4, OSP;
[0040] S5, Chong shape;
[0041] S6, SMT nickel sheet, NTC thermistor and connector;
[0042] And S7, paste and press the outer protective film. Wherein, S1 to S6 all adopt the existing technology, which will not be described here again. The specific process of S7 is as follows:
[0043] Provide a lamination fixture 2, such as image 3 with 4a As shown in -4c, the lamination fixture 2 includes a base plate 21, an intermediate elastic filling layer 22 and a cover plate 23. The base plate 21 is preferably an aluminum plate or steel plate with a thickness of 10...
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Abstract
The invention relates to an FPC product processing method, an FPC product is provided with a nickel sheet, an NTC thermistor, a connector and a connector reinforcer, and the method comprises the following steps: etching a circuit; pasting and pressing a protective film; pasting and pressing a connector for reinforcement; performing OSP; punching the shape; adopting an SMT nickel sheet, an NTC thermistor and a connector; and laminating the outer protective film. According to the method, SMT reflow soldering is only needed once, the production period is short, the efficiency is high, the OSP isnot damaged by high temperature before SMT, meanwhile, the tin melting phenomenon of a nickel sheet welding area caused by secondary reflow soldering is completely avoided, the reliability is high, meanwhile, an SMT tool carrier necessary for secondary SMT is omitted, and the production and manufacturing cost is greatly reduced.
Description
technical field [0001] The invention relates to the field of FPC processing, in particular to a method for processing FPC products. Background technique [0002] Flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, referred to as soft board or FPC, with high wiring density and light weight. , The characteristics of thin thickness. figure 1 An FPC product 1 is shown, which is used in a battery temperature monitoring system of a new energy vehicle, and has a nickel sheet 11 , an NTC thermistor 12 , a connector 13 and a connector reinforcement 14 . The conventional processing flow of this kind of FPC product is to etch the line - press the protective film - OSP - punch the shape - SMT soldering nickel sheet, NTC thermistor - press the outer protective film - press the connector reinforcement - SMT soldering connector , the process requires two furnace reflow soldering, long production cycle, low efficien...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/34H05K3/00H05K3/28
CPCH05K3/0058H05K3/282H05K3/3494H05K2201/05H05K2201/10022H05K2201/10189
Inventor 王文宝洪诗阅钟建莹
Owner XIAMEN BOLION CIRCUIT