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Slip sheet detection device and chemical mechanical polishing system

A detection device and sliding vane technology, applied in grinding devices, grinding/polishing equipment, grinding machine tools, etc., can solve problems such as affecting the efficiency of machine operation, affecting the accuracy of the sliding vane, and affecting the normal operation of the chemical mechanical polishing system. , to achieve the effect of solving false positives and improving accuracy

Pending Publication Date: 2020-12-11
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] False alarms may occur due to the water flow may form a mirror water film on the surface of the polishing pad, which affects the normal operation of the chemical mechanical polishing system to a certain extent and affects the efficiency of the machine operation
In addition, the water flow may be sprayed to the optical sensing device and form droplets on it, and the droplets may be located on the path of light emission or reception, thereby affecting the accuracy of slide detection

Method used

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  • Slip sheet detection device and chemical mechanical polishing system
  • Slip sheet detection device and chemical mechanical polishing system
  • Slip sheet detection device and chemical mechanical polishing system

Examples

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Embodiment Construction

[0040] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0041] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...

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Abstract

The invention discloses a slip sheet detection device and a chemical mechanical polishing system. The slip sheet detection device comprises a laser emitter, an optical fiber receiver and a controller;the laser emitter and the optical fiber receiver are arranged on a V-shaped support, the V-shaped support is arranged towards a polishing pad, the laser emitter emits laser towards the polishing pad,and the optical fiber receiver receives the reflected laser and converts the reflected laser into an electric signal; the controller judges whether a wafer slides out of a bearing head or not according to the electric signal of the optical fiber receiver; and the laser emitter and the optical fiber receiver are obliquely arranged relative to the polishing pad, so that liquid drops attached to thelaser emitter and the optical fiber receiver slide down and do not block a laser emitting and / or receiving path.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a slide detection device and a chemical mechanical polishing system. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process, and chemical mechanical polishing (Chemical Mechanical Planarization, CMP) is an ultra-precision surface processing technology for global planarization. [0003] In chemical mechanical polishing, the wafer is usually attracted to the bottom su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B49/12B24B37/34B24B37/20B24B37/30B24B37/005
CPCB24B37/005B24B37/20B24B37/30B24B37/34B24B49/12
Inventor 吴兴许振杰
Owner HWATSING TECH