Splicing coating method for semiconductor part

Abstract

The invention provides a splicing coating method for a semiconductor part. The method comprises the following steps: shielding the surface, making contact with a clamp in coating equipment, of the semiconductor part by adopting a protective film; coating the treated semiconductor part, and controlling the coating temperature and power to finish the coating of the non-shielding surface; attaching the protective film to the coated surface, and removing the original shielding protective film; and repeating the coating of the non-shielding surface, and removing the protective film on the coated surface after the coating is completed until the semiconductor part with the fully-coated surface is obtained. According to the method, the whole surface of the semiconductor part can be coated in a splicing coating manner, and particularly, the non-coating surface is shielded firstly, so that the consistency of coating in different sequences can be ensured, and the requirements of a subsequent welding process are met; and coating parameters are correspondingly adjusted according to selected semiconductor part materials, crystal grain change can be avoided, the strength performance of the part is guaranteed, and the method is suitable for different kinds of products and wide in application range.

Description

technical field

[0001] The invention belongs to the technical field of surface coating, and relates to a splicing coating method for semiconductor components. Background technique

[0002] With the continuous progress of society, the application fields of semiconductor products are becoming more and more extensive. Based on the diversity of semiconductor products, there are also many choices for their preparation processes. Coating method is one of the important methods, such as physical vapor deposition (PVD). For some semiconductor components, due to their application requirements, full-surface coating is required to meet the requirements of subsequent processes by ensuring the consistency and coverage of the coating.

[0003] At present, when using physical vapor deposition technology to prepare metal film layers, the commonly used methods include the hanging coating method. The surface of the product is punched with a process hole and then hung and clamped. If the proce...

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