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Press-fit terminal with improved whisker inhibition

A press-fit and terminal technology, applied in the direction of contact parts, connecting contact materials, printed circuits, etc., can solve the problems of increasing the risk of electrical short circuit

Inactive Publication Date: 2020-12-11
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the technological trend towards higher density connector solutions (closer pin-to-pin / hole-to-hole distances and much higher external force (i.e., kilograms)) further increases the risk due to the formation of tin whiskers. risk of electrical short circuit

Method used

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  • Press-fit terminal with improved whisker inhibition
  • Press-fit terminal with improved whisker inhibition
  • Press-fit terminal with improved whisker inhibition

Examples

Experimental program
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Effect test

example

[0034] The substrate used in the examples was a 3 cm x 3 cm brass substrate (Hull cell plate). Brass plates were plated with indium, tin and nickel as shown in Tables 2-9 below. The top or outer layer is indium or tin.

[0035] Before depositing the metal layer on the brass plate, use RONACLEAN TM GP-300 Electrocleaning Composition (available from DuPont Electronic Solutions, Wilmington, Delaware) was used to electroclean the brass plates. After electro-cleaning, the brass panels were immersed in aqueous 10 wt% sulfuric acid for 1-2 seconds at room temperature.

[0036] Metal plating baths were used to deposit indium, tin and nickel on brass plates and the thickness ranges, current densities and plating temperatures are disclosed in Table 1 below.

[0037] Table 1

[0038] Plating Baths and Parameters

[0039]

[0040] 1 Purchased from DuPont Electronic Solutions, Wilmington, DE.

[0041] After the brass plates were plated with a metal layer, they were rinsed with D...

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Abstract

A press-fit terminal for insertion into a conductive through-hole of a substrate includes an elastic deformation part with an outer and inner surface, the press-fit terminal includes, in sequence, a copper or copper alloy base, nickel or a nickel alloy barrier layer, a tin or tin alloy layer and an indium top layer. The press-fit terminal shows reduced whisker formation.

Description

technical field [0001] The present invention relates to a press-fit terminal with improved whisker suppression, wherein the press-fit terminal is to be inserted into a conductive via hole of a substrate. More particularly, the present invention relates to a press-fit terminal with improved whisker suppression, wherein said press-fit terminal with improved whisker suppression is to be inserted into a conductive via of a substrate, wherein said press-fit terminal comprises Having an outer surface and a linear elastically deformable portion on an inner surface, the press-fit terminal sequentially includes a copper or copper alloy base, a nickel or nickel alloy barrier layer, a tin or tin alloy layer, and an indium top layer. Background technique [0002] Since the implementation of the European Restriction of Hazardous Substances (RoHS) regulations in July 2006, it has been recognized that tin whiskers pose a more serious reliability threat to lead-free electronic components or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/58H01R13/03
CPCH01L23/481H01L23/5283H01R12/585H01R13/03H01R12/58H01R12/7064H01R4/58H05K1/115
Inventor 何莼
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC