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Adhesive composition for furniture molding having excellent adhesive force and thermal stability and material for furniture molding based thereon

A bonding composition, thermal stability technology, applied in the direction of chemical change inhibiting composition, adhesive type, polyurea/polyurethane adhesive, etc., can solve the problem of insufficient thermal stability, increased adhesive capacity, Manufacturing costs increase and other issues, to achieve excellent adhesion, improve its own durability, and excellent quality.

Active Publication Date: 2022-04-22
李兴洙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, there is a problem that the manufacturing cost increases due to the inevitable increase in the volume of the binder used to improve the adhesion, and there is little durability of the material due to insufficient thermal stability.
Also, it leads to waste of energy required for fusing the binder, so there is still room for improvement

Method used

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  • Adhesive composition for furniture molding having excellent adhesive force and thermal stability and material for furniture molding based thereon
  • Adhesive composition for furniture molding having excellent adhesive force and thermal stability and material for furniture molding based thereon
  • Adhesive composition for furniture molding having excellent adhesive force and thermal stability and material for furniture molding based thereon

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Embodiment Construction

[0035] Below, refer to the attached Figure 1 And describe the structure of the present invention and the functions and effects brought by the structure.

[0036] Advantages and characteristics of the present invention and the method for realizing these refer to and appended Figure 1 It will become clear from the Example which will mention later in detail. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of different embodiments, but this embodiment makes the disclosure of the present invention complete, and in order to give the technical field to which the present invention belongs It is provided that those skilled in the art fully inform the scope of the invention, and the present invention is defined only by the scope of the appended claims. And, the same reference numerals refer to the same structural elements throughout the specification.

[0037] The present invention relates to an adhesive for furn...

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Abstract

The present invention relates to an adhesive composition for furniture molding induced by maximization of durability and heat transfer including excellent adhesive force and thermal stability, and a material for furniture molding based thereon, characterized in that it comprises Polyurethane (Polyurethane) 60-80% by weight, polyamide (Polyamide) 10-20% by weight, ethylene-vinyl acetate copolymer (ethylene-vinyl acetate copolymer) 10-20% by weight and the rest of the additives, the additives are average particles Silica hybrid compound containing hydroxyl groups having a diameter of 30-50 nm. Therefore, the present invention not only has excellent adhesive force, but also has thermal stability above 100°C, improves its own durability and has improved rapid heat transfer performance, and thus excellent quality can be expected as a whole.

Description

technical field [0001] The present invention improves the technical idea related to adhesives for furniture molding, and more specifically relates to an adhesive combination for furniture molding induced by maximization of durability and heat transfer including excellent adhesive force and thermal stability Objects and furniture molding materials based on them. Background technique [0002] Adhesion refers to the state where two surfaces stick together due to the attractive force between molecules, atoms, and ions. Adhesion is not only a daily necessities such as tapes and adhesives, but also automobiles and cutting-edge semiconductor devices. Widely used, recently according to remarkable industrial development, the requirements for binders in various fields have become diversified. [0003] Polymer binders can be classified into chemical reaction type, solvent type, hot melt type, etc. according to the curing process. Among them, hot melt adhesive is a representative exam...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C09J177/00C09J123/08C09J11/04C09J11/08
CPCC09J175/04C09J11/04C09J11/08C08L2205/035C08L77/00C08L23/0853C08L75/08C08K3/36C09J177/00C09J123/0853C09J11/06C09K15/08C09K15/322C09J2301/312
Inventor 李兴洙
Owner 李兴洙
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