Microwave component circuit coupling transmission performance prediction method based on gold belt bonding configuration
A technology of microwave components and transmission performance, which is applied in the fields of instruments, computing, and electrical digital data processing, and can solve the problems of inability to accurately and effectively achieve signal transmission performance, discontinuity, and high labor costs.
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[0078] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0079] refer to figure 1 The present invention is a method for predicting the coupling transmission performance of microwave components based on gold ribbon bonding configuration, and the specific steps are as follows:
[0080] Step 1: Determine the geometric parameters and physical parameters of the gold ribbon bonding and interconnection in the microwave assembly
[0081] refer to figure 2 , 3 As shown in , 4, 5, the gold ribbon bonding interconnection in the high-frequency microwave assembly includes a grounding plate 4, a dielectric substrate 3 is connected on the upper layer of the grounding plate 4, and the conductor ribbons 2 connected on the dielectric substrate 3 are connected by the gold ribbon 1. . According to the specific requirements of interconnection in high-frequency microwave components, the geometric parameters and physical paramet...
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