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25G optical module circuit integration device

A technology of circuit integration and optical modules, which is applied in the direction of circuit heating devices, circuits, printed circuits, etc., can solve the problems of dense connection of lower-end lines, bumps at solder joints, and people's injuries, so as to save materials, facilitate snapping, Effects that prevent damage

Inactive Publication Date: 2020-12-18
HUANGSHAN OPTORAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing optical module circuit integration device has certain disadvantages in use. First of all, when it is used, the lower-end line connection is relatively dense, which is easy to cause damage. In addition, when welding is wrong, it is necessary to replace the welding plate as a whole, which is troublesome and brings certain adverse effects to people's use process. Therefore, we propose a 25G optical module circuit integration device

Method used

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  • 25G optical module circuit integration device
  • 25G optical module circuit integration device
  • 25G optical module circuit integration device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1, the positioning plate 201 is located on one side of the protection plate 204, the adjustment plate 207 is located on the other side of the protection plate 204, the hinge 206 is located on one side of the adjustment plate 207, the baffle plate 205 is located at both ends of the protection plate 204, and the drying layer 203 is positioned at the inside of protective plate 204, and positioning buckle 202 is positioned at the inboard of positioning plate 201, and between positioning plate 201 and positioning buckle 202, fixing block is arranged, and the inboard of positioning plate 201 is fixedly connected with one side of positioning buckle 202 by fixing block, A welding block is arranged between the protective plate 204, the positioning plate 201 and the adjusting plate 207, and the both sides of the protective plate 204 are fixedly connected with the inside of the positioning plate 201 and the adjusting plate 207 by the welding block, and one side of the adj...

Embodiment 2

[0027] In the second embodiment, the sealing and insulating pads 302 are located on both sides of the assembled board 301, the slider 303 is located inside the assembled board 301, the second pad 306 runs through the assembled board 301, the adjusting member 304 is located In the middle of the assembly plate 301, a chute is provided between the assembly plate 301 and the slider 303, the inside of both sides of the assembly plate 301 is movably connected with the outside of the slide block 303 through the chute, and the assembly plate 301 and the sealing insulating pad 302 are provided With superglue, the outer surface of the assembly board 301 is fixedly connected with the inner surface of the sealing insulating pad 302 through superglue. The assembly board 301 is provided with multiple groups, which are spliced ​​on the inner side of the device main body 1, which can facilitate and better assemble the circuit board It can be replaced separately when there is a problem in weldi...

Embodiment 3

[0028]Embodiment 3, the integrated circuit includes a relay module, a power supply circuit, a central processing module, a display module, a light emitting module group, and a temperature detection module, and the power supply circuit is connected with a relay module, a central processing module, a display module, a light emitting module group, and a temperature detection module, The central processing module is connected with a display module, a light-emitting module group, and a temperature detection module. The temperature detection module is connected with a light-emitting module group. The power circuit supplies power to the central processing module, the display module, the light-emitting module group, and the temperature detection module. The relay module controls the power circuit switch. The output end of the central processing module is electrically connected to the input end of the display module and the light emitting module group, and the output end of the temperatu...

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Abstract

The invention discloses a 25G optical module circuit integration device which comprises a device body and an integrated circuit, an optical module light emitting diode and a connector are fixedly connected with the outer surface of the upper end of the device body, the connector is located on the outer side of the optical module light emitting diode, and a detachable splicing welding plate mechanism is arranged on the inner side of the device body. The detachable splicing welding plate mechanism comprises a splicing plate, a sealing insulation pad, a sliding block, an adjusting piece, a cooling fin and a second bonding pad. The 25G optical module circuit integration device is provided with the adjustable clamping type bottom protection mechanism and the detachable splicing welding plate mechanism, an integrated circuit can be conveniently and better protected, clamping is convenient, damage is prevented, the 25G optical module circuit integration device has a certain dehumidification and damp-proof effect and is excellent in performance, the circuit board can be conveniently and better assembled, and can be independently replaced when a welding problem occurs, so that materials aresaved, the operation is more convenient, and a better application prospect is brought.

Description

technical field [0001] The invention relates to the field of optical module integrated circuits, in particular to a 25G optical module circuit integration device. Background technique [0002] The optical module circuit integration device is a support device for optical module integration. When the optical module is used, an integrated circuit is connected inside, which is convenient for better lighting control, increases the performance of the optical module, and has a better control effect. With the continuous development of science and technology, people have higher and higher requirements for the manufacturing process of the optical module circuit integration device. [0003] The existing optical module circuit integration device has certain disadvantages in use. First of all, when it is used, the lower-end line connection is relatively dense, which is easy to cause damage. In addition, when welding is wrong, it is necessary to replace the welding plate as a whole, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H01L23/367
CPCH01L23/3672H05K1/02H05K1/0203H05K1/18H05K1/181H05K2201/10007H05K2201/10053H05K2201/10121H05K2201/10128H05K2201/10151
Inventor 汪洋
Owner HUANGSHAN OPTORAY COMM
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