Multi-layer film residual stress and Young modulus on-line test structure for micro-manufacturing and on-line extraction method

Abstract

The invention belongs to the technical field of micro electro mechanical systems, and discloses an on-line test structure for Young modulus of a single-layer film and for micro-manufacturing, an on-line test structure for multi-layer film residual stress and Young modulus and an on-line extraction method. The Young modulus test structure of the single-layer film is composed of a set of transversely-pulled cantilever beam structures made of different film materials and contact electrodes. The transversely-pulled cantilever beam structures comprise single-layer films serving as upper electrodesand driving electrodes serving as lower electrodes. The Young modulus and residual stress test structure of the multi-layer film comprises top metal electrodes, multi-layer two-end clamped beam structures and bottom electrodes. As for the multi-layer two-end clamped beam structures of a group of test structures, two-end clamped beams are connected with a substrate through reinforcing anchor areas.The pull-in voltage of each test structure is measured by using electrostatic drive. The contact voltage and the pull-in voltage are sent into an extraction program for calculation to obtain the residual stress and the Young modulus of each layer of film. The testing method is simple, and can meet the precision requirement of on-line testing of a process line.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical technology, in particular to an on-line testing structure and on-line extraction method for residual stress and Young's modulus of multi-layer thin films used in micro-manufacturing. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) are commonly used in switches, inductors, variable capacitors, etc. in high-frequency circuits. However, mechanical parameters such as residual stress and Young's modulus in thin films and microstructures have a great influence on the static and dynamic responses of MEMS devices. In order to play the role of insulation or conductivity, or to overcome the warpage of the film, multi-layer film structures are often used in the production and processing of MEMS devices. On-line testing of micro-electro-mechanical products through general-purpose measuring instruments in the process line can reflect the level of process control in a timely manner....

AI Technical Summary

Problems solved by technology

[0003] Several existing techniques for measuring Young's modulus and residual stress of micro-scale thin films, such as nanoindentation method, Raman spectroscopy, resonance frequency method, etc., cannot directly extract the respective parameters of multilayer thin films, and It requires more complex analysis, is difficult to process, and the external testing equipment is also relatively complicated, which does not meet the requirements of online testing

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