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Multi-chip packaging structure

A technology of multi-chip packaging and light-emitting chips, applied in the field of lighting, can solve the problems of difficult heat dissipation, large heat generation, high work efficiency, etc., and achieve the effects of improving mechanical strength, improving dispersion, and improving stability.

Active Publication Date: 2020-12-25
东莞市谷麦光学科技有限公司 +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the heat dissipation of LED lights is a prominent problem. Poor heat dissipation will lead to an increase in the junction temperature of the LED, which in turn will lead to problems such as high heat generation, low luminous efficiency, and reduced service life.
[0004] The temperature rise of LED lamps is affected by many aspects. In addition to the performance of the LED light-emitting element itself, the heat dissipation capacity of the LED substrate is an important factor, followed by the thermal conductivity of the LED package and the external heat dissipation performance of the LED lamp, especially for multi-chip Due to the high working efficiency, the heat generation is large and it is difficult to dissipate heat

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051]byFigure 1 to Figure 6 It can be seen that the multi-chip packaging structure described in this embodiment includes a heat dissipation base 1 and a package base 2 connected to the heat dissipation base 1; the package base 2 is provided with a plurality of light-emitting chips 3;

[0052]The heat dissipation base 1 is provided with a circulating water tank 11; the circulating water tank 11 is provided with cooling liquid; the heat dissipation base 1 is provided with a heat dissipation water tank 12 communicating with the circulating water tank 11; the heat dissipation water tank 12 is provided on the light emitting chip 3 bottom of;

[0053]The heat dissipation base 1 is provided with a first ventilation slot 41; the light-emitting chip 3 is provided with a second ventilation slot 42 communicating with the first ventilation slot 41; the packaging seat 2 is provided with a second ventilation slot 42 communicating with The third ventilation slot 43.

[0054]Specifically, in the multi-chip...

Embodiment 2

[0066]The difference between this embodiment and Embodiment 1 is that the package seat 2 is cured by a silicone potting glue, and the silicone potting glue includes the following raw materials in parts by weight:

[0067]A component

[0068]First end vinyl silicone oil 100 parts

[0069]Composite filler 40 parts

[0070]Hydrogen silicone oil 3 parts

[0071]MQ silicone resin 30 parts

[0072]Inhibitor 0.05 parts

[0073]B component

[0074]100 parts of vinyl silicone oil at the second end

[0075]MQ silicone resin 30 parts

[0076]0.2 parts of platinum catalyst;

[0077]Wherein, the weight ratio of the A component and the B component is 1:1;

[0078]Wherein, the composite filler is prepared by the following method:

[0079](1) Dehydrate and dry the nano-silica, then add toluene for ultrasonic dispersion for 20 minutes, add the silane coupling agent kh560, continue ultrasonic dispersion for 3 minutes, transfer to a three-necked flask with a reflux condenser, and heat up to 80°C After 5 hours of heat preservation and react...

Embodiment 3

[0087]The difference between this embodiment and Embodiment 1 is that the package seat 2 is cured by a silicone potting glue, and the silicone potting glue includes the following raw materials in parts by weight:

[0088]A component

[0089]First end vinyl silicone oil 100 parts

[0090]Composite filler 50 parts

[0091]Hydrogen silicone oil 6 parts

[0092]MQ silicone resin 40 parts

[0093]Inhibitor 0.1 part

[0094]B component

[0095]100 parts of vinyl silicone oil at the second end

[0096]MQ silicone resin 40 parts

[0097]0.4 parts of platinum catalyst;

[0098]Wherein, the weight ratio of the A component and the B component is 1:1;

[0099]Wherein, the composite filler is prepared by the following method:

[0100](1) Dehydrate and dry the nano-silica, then add toluene for ultrasonic dispersion for 30 minutes, add silane coupling agent kh560, continue ultrasonic dispersion for 5 minutes, transfer to a three-necked flask with reflux condenser, and heat up to 90°C After heating for 7 hours, centrifugal separation af...

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Abstract

The invention relates to the technical field of illumination, in particular to a multi-chip packaging structure which comprises a heat dissipation base and a packaging base connected with the heat dissipation base. A plurality of light-emitting chips are arranged in the packaging base; a circulating water tank is arranged in the heat dissipation base; cooling liquid is arranged in the circulatingwater tank; the heat dissipation base is provided with a heat dissipation water tank communicated with the circulating water tank; the heat dissipation water tank is arranged at the bottom of the light-emitting chips; first ventilation grooves are formed in the heat dissipation base; the light-emitting chips are provided with second ventilation grooves communicated with the first ventilation grooves; and the packaging base is provided with third ventilation grooves communicated with the second ventilation grooves. According to the multi-chip packaging structure, the cooling liquid and the first ventilation grooves are formed in the heat dissipation base, so that the heat dissipation effect of the multi-chip packaging structure can be greatly improved.

Description

Technical field[0001]The present invention relates to the field of lighting technology, in particular to a multi-chip packaging structure.Background technique[0002]Compared with traditional light sources, LED has the advantages of small size, light weight, sturdy structure, low working voltage, long service life, energy saving and environmental protection. In recent years, it has been widely used in many fields, especially lighting.[0003]However, the heat dissipation of the LED lamp is a prominent problem. Poor heat dissipation will cause the LED junction temperature to rise, which in turn leads to problems such as large heat generation, low luminous efficiency, and reduced service life.[0004]The temperature rise of the LED lamp is affected by many aspects. In addition to the performance of the LED light-emitting element, the heat dissipation capacity of the LED substrate is an important factor, followed by the thermal conductivity of the LED package and the external heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L25/075H01L33/06H01L33/58H01L33/56
CPCH01L33/648H01L33/642H01L25/0753H01L33/06H01L33/58H01L33/56
Inventor 张诺寒廖勇军张坤
Owner 东莞市谷麦光学科技有限公司
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