Preparation method of silicon wafer with rough surface and the silicon wafer

Abstract

The embodiment of the invention provides a preparation method of a silicon wafer with a rough surface and the silicon wafer, and solves the technical problem that the silicon wafer is easy to generateviscous force in the prior art. According to the preparation method of the silicon wafer with the rough surface provided by the embodiment of the invention, the first film layer with relatively highsurface roughness is deposited on the surface of the silicon wafer subjected to plane polishing, then the first film layer is etched by adopting a full etching method, and at the moment, after the first film layer is completely etched, the silicon wafer with the rough surface is obtained. The roughness of the surface, far away from the substrate, of the first silicon plane layer is increased, thenetching is conducted on the surface, far away from the substrate, of the first silicon plane layer in an etching mode, grooves and protrusions are generated, the surfaces of the protrusions are provided with rough surfaces, and the silicon wafer with the rough surfaces is formed. When the silicon wafer is close to other film layers, the viscous force generated between two close surfaces is reduced, the sensitivity of an MEMS device is improved, and the probability that the MEMS device cannot be used is reduced.

Description

【Technical field】 [0001] The invention relates to the technical field of silicon wafers, in particular to a method for preparing a silicon wafer with a rough surface and the silicon wafer. 【Background technique】 [0002] Micro Electro Mechanical Systems (MEMS, Micro Electro Mechanical Systems) technology is known as a revolutionary high-tech in the 21st century. Its development began in the 1960s. It is an ingenious combination of microelectronics and micromechanics. It has been developed in recent years. A new type of interdisciplinary technology, which will have a revolutionary impact on human life in the future. It has many advantages such as tiny, intelligent, executable, integrable, good process compatibility, and low cost, so it has begun to be widely used in many fields. For example, MEMS accelerators are commonly used in automobiles (for example, in airbag systems), tablets or smartphones. [0003] Microelectromechanical systems (MEMS) devices are micromechanical d...

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Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a method for preparing an amorphous silicon wafer with a rough surface and an amorphous silicon wafer, which solves the problem that the smooth surface of the crystalline silicon wafer is close to the surface of other film layers in the prior art. It is easy to generate viscous force, which reduces the sensitivity of MEMS devices, and even makes the parts of MEMS devices immobile and unusable technical problems

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