Flat plate type loop heat pipe suitable for two vertical heat sources

A loop heat pipe, flat plate technology, used in indirect heat exchangers, lighting and heating equipment, etc., can solve the problem of inability to dissipate heat from two vertical heat sources, and solve the problem that the area and shape of the outlet do not match the vertical heating surface, avoid The effect of partial drying and small distance between micro-columns

Pending Publication Date: 2021-01-05
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the inability of the current flat-plate loop heat pipe to dissipate heat from two vertical heat sources, and propose a flat-plate loop heat pipe suitable for two vertical heat sources

Method used

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  • Flat plate type loop heat pipe suitable for two vertical heat sources
  • Flat plate type loop heat pipe suitable for two vertical heat sources
  • Flat plate type loop heat pipe suitable for two vertical heat sources

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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] see figure 1 and figure 2 , a flat-plate loop heat pipe suitable for two vertical heat sources, mainly including an evaporator 1, a jet pump 3, a jet heat exchange chamber 4 and a cooler 6. The bottom surface of the evaporator is a horizontal heat exchange surface 1-1, which is attached to the horizontal heat source, and the side of the jet heat exchange chamber 4 is a vertical heat exchange surface 4-3, which is attached to the vertical heat source. Cooler 5 adopts finned tube type air-cooled cooler. Wherein, the liquid outlet of the evaporator 1 is connected to the jet pump 3 through the third liquid pipeline 8, the gas outlet of the evaporator 1 is connected to the jet pump 3 through the steam pipeline 2, the jet pump 3 is connected to the jet heat exchange chamber 4, and the jet flow The heat exchange chamber 4 is connected to the liquid inlet of the eva...

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Abstract

The invention discloses a flat plate type loop heat pipe suitable for two vertical heat sources. The flat plate type loop heat pipe comprises an evaporator, an injection pump, a jet flow heat exchangecavity and a cooler, the bottom surface of the evaporator is a horizontal heat exchange surface, the side surface of the jet flow heat exchange cavity is a vertical heat exchange surface, a liquid outlet of the evaporator is connected with the injection pump, a gas outlet of the evaporator is connected with the injection pump, the injection pump is connected with the jet flow heat exchange cavity, and the jet flow heat exchange cavity is connected with a liquid inlet of the evaporator through the cooler. According to the flat plate type loop heat pipe suitable for the two vertical heat sources, the jet flow impact enhanced heat exchange technology is coupled with the loop heat pipe, so that the effect that heat dissipation is carried out on the two vertical heat sources is realized, and the advantages of high reliability and high jet flow impact heat exchange coefficient of the loop heat pipe are retained.

Description

technical field [0001] The invention belongs to the field of cooling and heat dissipation of electronic components, and relates to a heat pipe heat dissipation device, in particular to a flat plate loop heat pipe suitable for two vertical heat sources. Background technique [0002] With the continuous improvement of the integration and high frequency of electronic components, the calorific value continues to increase, and thermally induced failure has become the main form of failure of microelectronic devices. Taking a computer mainframe as an example, the common heat dissipation method is air cooling, and the heat dissipation device includes a finned heat sink and a fan. In order to dissipate the heat in time, the volume of the finned radiator above the CPU and the graphics card is constantly increasing, and the number and speed of the fans are also increasing, resulting in a large and heavy cooling device. And air cooling is limited by its inherent heat dissipation capaci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/0266F28D15/0275F28D15/046F28D2015/0291
Inventor 魏进家刘蕾杨小平张永海袁博周杰
Owner XI AN JIAOTONG UNIV
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