A method and device for gas-liquid assisted laser machining of micropores
A technology that assists lasers and processing positions. It is used in metal processing equipment, laser welding equipment, manufacturing tools, etc. It can solve the problems of splashing and sticking to the hole wall or material surface, affecting processing quality, and material overheating and discoloring. Effects of spatter adhesion, hole machining depth and machining efficiency improvement, and machining quality improvement
Active Publication Date: 2022-06-21
AECC AVIATION POWER CO LTD
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Problems solved by technology
However, through the single gas assisting effect, it was found that the heat accumulation caused the local overheating and discoloration of the material, the expansion of the heat-affected zone, and the splashing and adhesion of the melt to the hole wall or the surface of the material could not be well solved, which seriously affected the processing quality.
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[0026] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0027] As a specific embodiment of the present invention, a gas-liquid-assisted laser processing method for micropores is as follows:
[0028] Install and locate parts: install and locate parts on laser processing equipment through tooling;
[0029] Laser processing of micro-holes: use laser processing equipment to emit a laser beam to process the position to be processed on the part, and at...
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The invention discloses a method and device for gas-liquid assisted laser machining of microholes. The position to be processed is processed by emitting a laser beam, and an auxiliary gas coaxial with the laser beam is used to spray the processing position. Auxiliary liquid jetting processing positions where the axes form a certain angle. The present invention forms a complete set of processing methods, through gas-liquid assisted laser micro-hole processing, realizes high-quality laser micro-hole processing, reduces spatter adhesion, and reduces material heat-affected areas (take away part of the heat through gas cooling and cooling liquid cooling, Reduce heat accumulation), improve the surface quality of materials.
Description
technical field [0001] The invention belongs to the field of special processing, and in particular relates to a method and a device for gas-liquid assisted laser processing of micro-holes. Background technique [0002] At present, laser processing mainly relies on gas-assisted micro-hole processing. Different auxiliary processing gases (oxygen, hydrogen, argon, nitrogen, compressed air, etc.) are selected according to the characteristics of the processed materials. The main purpose is to accelerate the gasification and melting of materials, or It is to remove slag, reduce the adhesion of splashes, reduce the heat affected area of the material (gas heat dissipation takes away part of the heat and reduce heat accumulation), reduce the oxidation of the material surface and the hole wall, and improve the surface processing quality of the material and the quality of the hole wall. However, through the single gas-assisted effect, it is found that the heat accumulation causes the...
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IPC IPC(8): B23K26/382B23K26/146
CPCB23K26/382B23K26/146B23K26/1435
Inventor 王琦邹兆安崔庞博张婷李璇耿军儒梁养民梁晨涛
Owner AECC AVIATION POWER CO LTD