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Preparation method of bulletproof insert plate, electronic equipment and storage medium

A bulletproof insert, bulletproof fiber technology, applied in protective equipment, offensive equipment, protective equipment, etc., can solve the problems of easy sputtering of fragments, secondary damage, etc., to improve the protection coefficient, reduce energy absorption pressure, and improve bulletproof capability. Effect

Inactive Publication Date: 2021-01-15
沈阳中钛装备制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bulletproof inserts in the prior art are easy to achieve stress concentration in the transition layer, and the fragments are easy to sputter and cause secondary damage.

Method used

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  • Preparation method of bulletproof insert plate, electronic equipment and storage medium
  • Preparation method of bulletproof insert plate, electronic equipment and storage medium

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Experimental program
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Effect test

preparation example Construction

[0039] Such as figure 1 As shown, the present invention provides a kind of preparation method of bulletproof board, comprising:

[0040] S100, preparing a protective ceramic substrate, and preparing a ceramic Ti modified coating on the surface of the protective ceramic substrate;

[0041] S200, preparing a titanium alloy porous plate;

[0042] S300. Bond the protective ceramic substrate, titanium alloy porous plate and PE bulletproof fiber plate in order of curvature from small to large to form a bulletproof insert;

[0043] S400, performing autoclave compounding on the bulletproof plate.

[0044]The preparation method of the bulletproof board provided by the embodiment of the present invention, by improving the structure of the traditional bulletproof board, using a titanium alloy porous plate as a flexible transition layer, relying on its own structural advantages, the stress is further released in the transition layer, ensuring that the protective ceramics On the basis o...

Embodiment 1

[0066] Embodiment 1. Preparation of a protective ceramic substrate with a thickness of 5.5 mm:

[0067] First, take D50, 0.5 micron boron carbide powder 92%, rare earth oxide RE1.5%, and other sintering aids YO3%. The protective ceramic matrix is ​​prepared through the processes of drum mixing, spray granulation, cold pressing, hot pressing and sintering;

[0068] Secondly, ultrasonically wash the protective ceramic substrate with pure water at 30 degrees for 8 hours. After taking it out, use acetylacetonate (10g / L) and sodium hydroxide (7g / L) to emulsify and wash it for 3 times, and then use flowing pure water Wash 5 times. Place it in an oven at 120°C for 10 hours and take it out for later use. The Ti coating is deposited by the chemical vapor deposition method. The area of ​​the ceramic protective substrate is linearly related to the mass of the titanium powder, which is about 4g / square decimeter. The material ratio of the titanium bromine reactor is 1:5. 10 degrees per ...

Embodiment 2

[0075] Embodiment 2. Preparation of a protective ceramic substrate with a thickness of 9.5 mm:

[0076] First, take 92% of D50, 1.0 micron boron carbide powder, 1.5% of rare earth oxide RE, and 3% of other sintering aids. The protective ceramic matrix is ​​prepared through the processes of drum mixing, spray granulation, cold pressing, hot pressing and sintering;

[0077] Secondly, ultrasonically wash the protective ceramic substrate with pure water at 30 degrees for 8 hours. After taking it out, use acetylacetonate (10g / L) and sodium hydroxide (7g / L) to emulsify and wash it for 3 times, and then use flowing pure water Wash 5 times. Place it in an oven at 120°C for 10 hours and take it out for later use. The Ti coating is deposited by the chemical vapor deposition method. The area of ​​the ceramic protective substrate is linearly related to the mass of the titanium powder, which is about 3g / square decimeter. The material ratio of the titanium bromine reactor is 1:5. 10 degr...

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Abstract

The invention relates to the field of preparation of protective parts, and provides a preparation method of a bulletproof insert plate, electronic equipment and a storage medium. The preparation method of the bulletproof insert plate comprises the following steps that a protective ceramic base body is prepared, and a ceramic Ti modified coating is prepared on the surface of the protective ceramicbase body; a titanium alloy porous plate is prepared; the protective ceramic base body, the titanium alloy porous plate and a PE bulletproof fiber pressing plate are sequentially bonded according to the curvature from small to large to form the bulletproof insert plate; and autoclave compounding is conducted on the bulletproof insert plate. According to the preparation method of the bulletproof insert plate, stress is released in a transition layer, and on the basis of ensuring that secondary damage cannot be caused by crushing and sputtering of the protective ceramic base body, the energy absorption pressure of the PE bulletproof fiber pressing plate is reduced, so that back bulges are reduced; and meanwhile, the overall adhesive property of the protective ceramic base body can be improved, so that the combining capacity of the protective ceramic base body, the titanium alloy porous plate and the PE bulletproof fiber pressing plate is enhanced.

Description

technical field [0001] The invention relates to the field of preparation of protective parts, in particular to a method for preparing a bulletproof board, electronic equipment and a storage medium. Background technique [0002] The development of bullet-proof inserts has always been an important subject of protective equipment. In recent years, the bullet-proof main body of bullet-proof inserts has developed from alloy metal plates such as steel plates to hard ceramic plates. Urea, on this basis, a large number of related composite colloids and composite methods have also been developed. However, the bulletproof inserts in the prior art are easy to realize stress concentration in the transition layer, and the fragments are easy to sputter and cause secondary damage. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a method for preparing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F41H5/04B32B9/00B32B9/04B32B15/04B32B15/085B32B15/14B32B27/02B32B27/32B32B27/06B32B33/00B32B37/06B32B37/10B32B38/04B32B37/12B32B27/34B32B3/24
CPCF41H5/0457B32B9/005B32B9/041B32B9/047B32B9/045B32B3/266B32B15/04B32B15/14B32B15/085B32B5/02B32B33/00B32B37/06B32B37/10B32B38/04B32B37/12B32B2262/0253B32B2255/205B32B2571/02B32B2038/042B32B2262/0269
Inventor 王宏丛良超钟军刘智营孙宏伟郭方慧孟庆海
Owner 沈阳中钛装备制造有限公司
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