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Continuous flow system and method for coating substrates

A technology of equipment and substrates, applied in the field of continuous equipment, can solve the problems of increasing the complexity and error rate of continuous equipment

Pending Publication Date: 2021-01-15
新格拉斯科技集团
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] Conventional methods for increasing the throughput of in-line equipment, especially vacuum isolation chambers, often increase the complexity and error rate of in-line equipment

Method used

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  • Continuous flow system and method for coating substrates
  • Continuous flow system and method for coating substrates
  • Continuous flow system and method for coating substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0258] Aspect 1: Continuous equipment for coating substrates, including:

[0259] a processing module or processing modules; and

[0260] A vacuum isolation chamber for isolating substrates in or for isolating substrates, wherein the vacuum isolation chamber includes a chamber for receiving a substrate carrier having a plurality of substrates.

[0261] Aspect 2: The continuous apparatus of aspect 1, wherein the vacuum isolation chamber further comprises a fluid channel arrangement for evacuating and filling the chamber, wherein the fluid channel arrangement has a first channel for evacuating and filling the chamber and a fluid channel arrangement for evacuating and filling the chamber A second channel of the chamber is filled, wherein the first channel and the second channel are disposed on opposite sides of the chamber.

[0262] Aspect 3: The continuous plant according to aspect 1 or aspect 2, wherein at least one processing module has a plasma source, a gas supply for suppl...

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Abstract

The invention relates to a continuous flow system (100) for coating substrates (103) comprising a treatment module (130) and a vacuum sluice (110, 150) for introducing the substrates (103) or for discharging the substrates (103). The vacuum sluice (110, 150) has a chamber for receiving a substrate carrier (102) having a plurality of substrates (103) and a flow channel arrangement for evacuating and flooding the chamber. The flow channel arrangement comprises a first channel for evacuating and flooding the chamber and a second channel for evacuating and flooding the chamber, wherein the first channel and the second channel are arranged on opposite sides of the chamber.

Description

technical field [0001] The invention relates to a continuous plant, in particular a vacuum continuous plant, for coating substrates, and to a method for coating a substrate, in particular a vacuum method. In particular, the present invention relates to in-line equipment configured for coating lighter substrates, especially silicon wafers. The continuous apparatus and the method may be configured for continuous coating of substrates. Background technique [0002] Continuous substrate processing plants are known, for example, from EP 2 276 057 B1. Therein, the substrate is brought into the vacuum processing chamber by means of a substrate transport system and removed again after processing. A horizontal substrate carrier is used here as the substrate transport system, on which the substrate lies flat. [0003] US 2013 / 0031333 A1 discloses an apparatus for processing a plurality of substrates, the apparatus comprising an isolation chamber. [0004] WO 2015 / 126439 A1 disclos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/56C23C16/34C23C16/54H01L21/02H01L21/67H01L21/677
CPCH01L21/67201C23C14/566C23C14/568H01L21/6776H01L21/67173C23C16/54C23C16/345H01L21/67706H01L21/6719H01L21/67017H01L31/1804H01L31/022425Y02P70/50Y02E10/547C23C14/0652C23C14/3407C23C16/50H01J37/32788H01J37/32834H01J37/34H01J2237/332
Inventor 伯恩哈德·科德迈克尔·赖斯迪特尔·谢尔格托尔斯滕·迪佩尔弗兰克·梅彼得·沃尔法特奥利弗·霍恩
Owner 新格拉斯科技集团
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