Efficient baking device for electronic component processing

Abstract

The invention relates to an efficient baking device for electronic component processing. The efficient baking device comprises a baking oven, wherein an oven door is arranged on the front side and / orthe back side of the baking oven; an air inlet pipe is arranged at the top of the baking oven; an air outlet of the air inlet pipe enters the baking oven and communicates with at least one air spraying pipe; the air spraying pipe is horizontally suspended in the baking oven and is parallel to the oven door; at least one electric baking pipe parallel to the air spraying pipe is arranged under theair spraying pipe; a wire mesh box positioned and supported by a clamping device is arranged under the electric baking pipe; the wire mesh box is parallel to the axial direction of the electric bakingpipe; a rotating shaft of the clamping device is supported and positioned by a bearing arranged at the side wall of the baking oven; one rotating shaft of one pair of clamping devices is in transmission connection with an output shaft of a speed reducing motor; and an air outlet is formed in the side wall of the baking oven. The efficient baking device for electronic component processing has theadvantages that the baking on electronic components is more uniform and softer; the components cannot be easily burnt; the baking speed is high; the operation efficiency is high; meanwhile, and the operation is very convenient and fast, so that the baking processing quality and efficiency of the electronic components can be favorably improved.

Description

technical field [0001] The invention relates to the technical field of processing equipment for electronic components, in particular to a high-efficiency baking device for processing electronic components. Background technique [0002] Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, base substrates for printed circuits, special materials for electronic functional processes, electronic glue (tape) products, electronic Chemical materials and parts, etc. [0003] Electronic components often need to be baked during processing and production, and baking processing r...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high-efficiency baking device for processing electronic components to solve the problem of poor baking effect of current equipment on electronic components (uneven baking, easy to burn components), The baking speed is slow, the operation efficiency is low, and the operation is not convenient enough

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