Diffusion bonding preparation method of titanium alloy hollow structure
A technology of diffusion connection and hollow structure, which is applied in the field of titanium alloy manufacturing, can solve problems such as insufficient manufacturing efficiency, increased tonnage, and mold deformation, and achieve the effects of guaranteed performance, improved manufacturing efficiency, and uniform quality
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2021-02-19
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Abstract
Description
technical field
[0001] The invention relates to the technical field of titanium alloy manufacturing, in particular to a method for preparing a titanium alloy hollow structure by diffusion connection. Background technique
[0002] Titanium alloy hollow sandwich structure can be prepared by dividing two parts into two halves, and then diffusion connection. This method has the characteristics of simple process path, low equipment requirements, and wide range of applicable materials. It is widely used in aerospace There are many fields of application.
[0003] The existing diffusion bonding method to prepare titanium alloy and titanium-aluminum alloy hollow sandwich structures has the following shortcomings:
[0004] 1. The mold has high requirements. Under the action of high temperature and high pressure for a long time, the mold will be deformed, and it needs to be replaced or reprocessed after a certain number of uses;
[0005] 2. The requirements for hydraulic press equipm...
Examples
Embodiment Construction
[0038] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The detailed description and accompanying drawings of the following embodiments are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments, without departing from the spirit of the present invention Any modification, substitution and improvement of parts, components and connection methods are covered under.
[0039] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0040] Please refer to Figure 1 to Figure 4 , a method for preparing a titanium alloy hollow s...