Flexible thin film device and preparation method thereof
A thin-film device and flexible thin-film technology, applied in the field of flexible thin-film devices and their preparation, can solve the problems of flexibility and high temperature resistance, and achieve the effect of a simple preparation method
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Embodiment 1
[0039] This embodiment provides a method for preparing a flexible thin film solar cell, the steps are as follows:
[0040](1) A mica sheet with a size of 10cm×10cm and a thickness of 1mm (its single-layer lattice structure is 0.7nm) is selected as a high-temperature-resistant substrate for preparing copper indium gallium selenide thin film solar cells.
[0041] (2) Prepare the following film layers sequentially on the mica sheet: a metal molybdenum back electrode film layer with a thickness of 400 nm is deposited by magnetron sputtering, and a copper indium gallium selenide semiconductor layer with a thickness of 1.5 μm is deposited by co-evaporation at a process temperature of 600° C. to 700° C. For the light absorbing layer, a 50nm thick CdS buffer film layer is deposited in a chemical bath, a 50nm thick intrinsic ZnO layer and an 800nm thick aluminum-doped ZnO film layer are magnetron sputtered.
[0042] (3) Use a Scotch scotch tape with a width of 15 cm to press and stic...
Embodiment 2
[0048] This embodiment provides another method for preparing a large-area flexible thin-film solar cell, the steps are as follows:
[0049] (1) In order to obtain a large-area flexible thin-film solar cell, select 100 mica sheets with a size of 10cm×10cm and a thickness of 1mm, and connect these mica sheets to each other by mosaic or bonding to form a large area of 100cm×100cm The substrate is used as a high temperature resistant substrate for the preparation of copper indium gallium selenide thin film solar cells. The large-area preparation of other high-temperature-resistant layered substrates (such as graphite, etc.) is similar to this method.
[0050] (2) Prepare the following film layers sequentially on the above-mentioned large-area layered structure substrate: a metal molybdenum back electrode film layer with a thickness of 400 nm is deposited by magnetron sputtering, and a 1.5 μm film is deposited by co-evaporation at a process temperature of 600 ° C to 700 ° C Thic...
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Abstract
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Application Information

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