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Wafer etching rotating mechanism

A technology for rotating mechanisms and wafers, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve the problems of uneven depth of etching grooves and insufficient precision, and achieve good fixing effect, reasonable structure and strong practicability Effect

Pending Publication Date: 2021-03-02
吉姆西半导体科技(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on the existing wafer etching rotation mechanism generally can only rotate in one direction, but if the wafer is only rotated in one direction during the etching process, it is easy to cause the depth of the etching groove of the wafer to be not uniform enough, And the technical problems of shortcomings such as insufficient precision, the present invention proposes wafer etching rotating mechanism

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0029] refer to Figure 1-4 , the wafer etching rotation mechanism, including a workbench 9, the bottom outer wall of the workbench 9 is fixed with a connecting plate by bolts, the top outer wall of the connecting plate is fixed with a motor 14 by bolts, and the output shaft of the motor 14 is connected with a rotating shaft through a coupling. Rod 15, one end of rotating rod 15 is fixed with rotating plate 11 by bolt, and the top outer wall of rotating plate 11 is provided with sealing mechanism, both sides of both sides outer walls of workbench 9 are all fixed with mounting frame 7 by bolt, the outer wall of mounting frame 7 A top plate 1 is slidingly connected, the top outer wall of the top plate 1 is provided with an atomizing mechanism, the outer wall of the rotating rod 15 is bolted with a rolling rubber cloth 13, and the top outer wall of the workbench 9 is provided with a mounting groove, and both sides of the inner wall of one side of the mounting groove are There is ...

Embodiment 2

[0040] refer to Figure 5 , the wafer etching rotating mechanism. Compared with Embodiment 1, this embodiment also includes that the inner wall of the etching cylinder 2 is fixed with a deflector 28 by bolts, and the deflector 28 is used in conjunction with the rotating plate 11. Due to the spraying In the process of spraying the hydrochloric acid spray by the plate, the hydrochloric acid spray may be sprayed outside the etching cylinder 2, which may cause personal injury. The excess hydrochloric acid spray can enter the collection ring 20 for storage through the deflector 28, which is convenient for people. Centralized treatment of acid.

[0041] During use, the hydrochloric acid spray may be sprayed out of the etching cylinder 2 during the process of spraying the hydrochloric acid spray by the spray plate, thereby causing personal injury, and the excess hydrochloric acid spray can be allowed to enter the collection ring 20 through the deflector 28 It is convenient for peopl...

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Abstract

The invention belongs to the technical field of wafer etching, particularly relates to a wafer etching rotating mechanism, and aims to solve the problems that an existing wafer etching rotating mechanism generally can only rotate towards one direction, but if a wafer only rotates towards one direction in the etching process, so the depth of an etching groove of the wafer is not uniform enough, andthe precision is low. The invention provides the following scheme that the wafer etching rotating mechanism comprises a workbench, a connecting plate is fixed to the outer wall of the bottom of the workbench through bolts, a motor is fixed to the outer wall of the top of the connecting plate through bolts, an output shaft of the motor is connected with a rotating rod through a coupler, and a rotating plate is fixed to one end of the rotating rod through bolts. According to the invention, a telescopic spring pulls a winding rubber cloth to retract back until a motor reverse rotation switch ispulled next time, and the process is repeated, so that the rotating plate can be controlled to rotate for several circles and then rotate reversely for several circles, and a better etching effect ofthe wafer in the etching process can be ensured.

Description

technical field [0001] The invention relates to the technical field of wafer etching, in particular to a wafer etching rotating mechanism. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch wafers. The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment become more advanced, new data characteristics emerge in wafer processing. At the same time, the reduction of the feature size increases...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6838H01L21/67075
Inventor 李程李松松姚鑫杰
Owner 吉姆西半导体科技(无锡)有限公司