Double-sided laminated airtight brazing system and method in 3D microwave radio frequency module

Abstract

The invention discloses a double-sided laminated airtight brazing system and method in a 3D microwave radio frequency module. The double-sided laminated airtight brazing system comprises an upper tool, a connector, a connector solder ring, a module tube shell, substrate solder, a substrate, surface layer device solder, a surface layer device, elastic tools and a lower tool. The connector and the connector solder ring are arranged between the upper tool and the module tube shell. The substrate solder, the substrate, the surface layer device solder, the surface layer device and the elastic toolsare arranged between the lower tool and the module tube shell. According to the double-sided laminated airtight brazing system and method in the 3D microwave radio frequency module, a double-sided one-time welding mode is adopted, the upper tool and the lower tool are used for clamping devices to be welded, one or more surface layer devices to be welded are limited on the welding face through oneor more elastic tools, and therefore the surface layer device is ensured not to fall off in the welding process, one-time laminated welding of one or more surface layer devices to be welded is achieved, and high welding penetration rate and airtight brazing can be guaranteed for microwave dielectric plates, surface layer devices and connectors of different shapes and types.

Description

technical field [0001] The invention relates to the technical field of microwave radio frequency module welding, in particular to a double-sided laminated airtight brazing system and a brazing method in a 3D microwave radio frequency module. Background technique [0002] With the development of modern radar in the direction of miniaturization and light weight, the integration degree of radio frequency and microwave components is getting higher and higher, and the volume is getting smaller and smaller. Compared with the traditional two-dimensional circuit design, the three-dimensional multi-layer superimposed circuit design is becoming more and more Most of them appear in the design of microwave radio frequency modules. It is usually necessary to superimpose a layer of surface devices with certain functions on the surface of the substrate, thereby compressing the volume of the module and increasing the assembly density. At the same time, surface devices also need to be connec...

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Problems solved by technology

[0003] At present, the welding method used in the industry is generally to first use high-temperature solder to weld the connector, then use medium-temperature solder to weld the substrate, and finally use low-temperature solder to surface devices on the substrate. The welding process is complicated and the efficiency is low. huge waste of energy

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