FOSB full-automatic packaging method for nitrogen-charged two-layer packaging

Abstract

The invention discloses an FOSB full-automatic packaging method for nitrogen-charged two-layer packaging. An adopted device comprises a moving module, a feeding station, a first preparation station, afirst nitrogen charging transition station, a first nitrogen charging station, a second nitrogen charging transition station, a second nitrogen charging station, a second preparation station, a bagging station, a sealing shaping station, a packaging checking station, a secondary packaging transition station and a discharging station. The full-automatic method takes 36 seconds as a beat, and the whole packaging sequence is completed by taking the beat as sequence. According to the FOSB full-automatic packaging method for nitrogen-charged two-layer packaging, the full-automatic process of nitrogen-charged two-layer packaging can be completed, the whole process is high in automation degree and packaging efficiency, and multiple FOSBs can be packaged at the same time.

Description

technical field [0001] The invention relates to the field of automatic packaging of front-opening chip packaging boxes, and more specifically relates to a fully automatic packaging method for FOSB with nitrogen-filled two-layer packaging. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increa...

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Problems solved by technology

[0008] The purpose of the present invention is to solve the problem that the existing nitrogen-filled secondary packaging of FOSB basically adopts manual packaging, the packaging efficiency is slow, the packaging quality is unstable, and the ordinary packaging box packaging method cannot apply to the FOSB packaging requirements of nitrogen-filled secondary packaging. A fully automatic packaging method for FOSB with nitrogen-filled secondary packaging is proposed, which can improve the degree of automation of FOSB packaging that requires nitrogen-filled secondary packaging, improve the packaging efficiency of FOSB, reduce labor costs, and improve product packaging quality. Reduce the waiting time of other processes in the bottleneck link and improve the overall efficiency of FOSB packaging

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