Nickel oxide electrochromic film and preparation method and application thereof
An electrochromic and electrochromic device technology, applied in chemical instruments and methods, nickel compounds, inorganic chemistry, etc., can solve problems such as unfavorable applications, difficult film deposition, low faded state transmittance, etc. The effect of over-rate and optical modulation amplitude, improving electrochromic response speed, and fast fading response time
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[0038] As an aspect of the technical solution of the present invention, it relates to a method for preparing a nickel oxide electrochromic film, which includes:
[0039] Using magnetron sputtering technology to co-dope nickel oxide M x T y Ni z O is a cathode target material, and an inert gas is used as a working gas to deposit a nickel oxide film on the surface of the substrate, wherein the first doping element M includes at least one of lithium, sodium, potassium, rubidium, and cesium, and the second doping element The element S includes at least one of aluminum, silicon, and zirconium, x:y:z=(0.1~1):(0.01~0.5):1; and,
[0040] The obtained nickel oxide thin film is annealed to obtain the nickel oxide electrochromic thin film.
[0041] In some preferred embodiments, the process conditions adopted by the magnetron sputtering technology include: the sputtering method is radio frequency sputtering or intermediate frequency sputtering, the working gas is an inert gas, the sub...
Embodiment 1
[0072] The preparation method of nickel oxide electrochromic thin film in the present embodiment specifically comprises the following steps:
[0073] Step 1. Magnetron sputtering deposition of nickel oxide film
[0074] The co-doped nickel oxide target M x T y Ni z O is placed in the magnetron sputtering coating equipment, and nickel oxide film is deposited on the ITO transparent conductive glass substrate, wherein, M is lithium, T is silicon, x:y:z=0.5:0.2:1, during the sputtering process The main parameters of are as follows:
[0075] (1) The sputtering method is radio frequency sputtering, and the working gas is pure argon;
[0076] (2) The substrate temperature is 100°C;
[0077] (3) The background vacuum is 5×10 -2 Pa;
[0078] (4) The sputtering pressure value is 1.0Pa;
[0079] (5) The power density of sputtering is 4.0W / cm 2 , the deposition time is 30min;
[0080] (6) The thickness of the film is 200nm;
[0081] Step 2, rapid annealing of nickel oxide film ...
Embodiment 2
[0084] The preparation method of nickel oxide electrochromic thin film in the present embodiment specifically comprises the following steps:
[0085] Step 1. Magnetron sputtering deposition of nickel oxide film
[0086]The co-doped nickel oxide target M x T y Ni z O is placed in a magnetron sputtering coating device, and a nickel oxide film is deposited on an ITO transparent conductive glass substrate, wherein, M is sodium, T is silicon, x:y:z=0.3:0.4:1, during the sputtering process The main parameters of are as follows:
[0087] (1) The sputtering method is radio frequency sputtering, and the working gas is pure argon;
[0088] (2) The substrate temperature is 80°C;
[0089] (3) The background vacuum is 3×10 -2 Pa;
[0090] (4) The sputtering pressure value is 1.2Pa;
[0091] (5) The power density of sputtering is 3.0W / cm 2 , the deposition time is 40min;
[0092] (6) The thickness of the film is 150nm;
[0093] Step 2, rapid annealing of nickel oxide film
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