The invention relates to the technical field of injection molds, and discloses a
semiconductor packaging injection mold which comprises a fixed mold, a movable mold, a supporting table, a double-shaft telescopic air cylinder, an injection molding cavity, a multi-point controllable ejector pin mechanism, a hydraulic demolding mechanism and the like. According to the mold, balanced closing and separation of the movable mold are achieved through the double-shaft telescopic air cylinder, the injection molding cavity is matched with the surface of a
semiconductor packaging product, and the accuracy of the sealing cavity is ensured. The multi-point controllable ejector pin mechanism is composed of ejector pins, reset springs and magnetic pushing assemblies, the ejector pins are distributed in a matrix mode, and damage to packaged products is reduced. And the hydraulic demolding mechanism realizes uniform injection of a demolding agent through a conveying hole, a liquid guide
pipe and an anti-
reflux valve, so that the stability and no damage in the demolding process are ensured. According to the mold,
automatic control is combined, synchronous forming of the
double injection molding cavities is achieved, the productivity is effectively improved,
silicone oil emulsion is adopted as a
release agent, a lubricating film is formed, and the production efficiency and the product quality are improved.