Substrate clamp for vertical double-sided film coating

A double-sided coating and substrate technology, which is applied in sputtering, ion implantation, gaseous chemical plating, etc., can solve the problems of slag loss, chip breaking, and need to turn the film on the coating structure, so as to achieve mass production. The effect of automatic operation and easy mass production of automatic operation

Pending Publication Date: 2021-03-09
SUZHOU SHENGCHENG SOLAR EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Whether it is a conventional PERC battery, a TOPcon structure, or a HIT structure, a plasma coating process is required to prepare a thin film. At present, the conventional coating equipment is basically a horizontal structure, and the carrier plate is driven by a plate roller. The carrier structure used in this transmission method is often the same as The groove structure corresponding to the size of the silicon wafer, the silicon wafer is limited by the groove due to its own weight, and this coating structure often has shortcomings such as slag dropping and the need to turn over the wafer. Vertical coating equipment has gradually become a design solution for consideration. The carrier board required by the scheme is close to the vertical transmission, and the direct use of the conventional carrier board will have a high probability of falling off the risk of fragments. Based on the above defects and deficiencies, it is necessary to improve the existing technology and design a A substrate fixture for vertical double-sided coating

Method used

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  • Substrate clamp for vertical double-sided film coating
  • Substrate clamp for vertical double-sided film coating
  • Substrate clamp for vertical double-sided film coating

Examples

Experimental program
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specific Embodiment 1

[0035] The upper tray 02 is designed with a single hollow piece, such as image 3 As shown, the hollowed out piece is fully open and hollowed out, which is convenient for double-sided coating. The corresponding lower tray 01 is designed as follows Figure 4 As shown, the middle of the lower tray 01 is designed to be fully open and hollowed out.

specific Embodiment 2

[0037] The upper tray 02 is designed with a plurality of hollowed-out slots, which are regularly arranged in a fully-opened hollow shape, such as Figure 5 As shown, the corresponding lower tray 01 is designed as Image 6 As shown, the middle of the lower tray 01 is designed as a regular arrangement of fully open hollows.

[0038] When a substrate fixture for vertical double-sided coating of the present invention is in operation, after the substrate 03 is placed on the lower tray 01, force is applied to the baffle 043 of the clamping device 04, and the upper compression spring 042 leaves a space, and the upper The tray 02 can be moved into the corresponding position in parallel, the trapezoidal boss 021 fits with the trapezoidal groove 011, the upper tray 02 and the lower tray 01 fit together, the base plate 03 is fixed in the middle position by the edge stoppers and four corner stoppers of the two trays, draw To remove the force applied to the baffle 043, the baffle 043 clam...

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Abstract

The invention discloses a substrate clamp for vertical double-sided film coating. The substrate clamp for vertical double-sided film coating comprises a lower tray, an upper tray, a substrate, clamping devices and a main body bracket, wherein the clamping device is locked on the main body bracket, the substrate is clamped between the lower tray and the upper tray, and the substrate is clamped between the upper tray and the lower tray; the lower tray and the upper tray are clamped and attached through the clamping devices, hollowed-out sheet positions are arranged on the lower tray and the upper tray, the edges of the hollowed-out sheet positions extend outwards to be provided with edge stop blocks, the four corners of the hollowed-out sheet positions are provided with four-corner stop blocks, and trapezoidal bosses are arranged on the edges of a frame on the periphery of the upper tray; and trapezoidal grooves matched with the trapezoidal bosses are formed in the lower tray, and the substrate is limited in a narrow space in the middle by the edge stop blocks and the four-corner stop blocks. In this way, the phenomena of wafer falling and wafer inclining are not liable to happen; double-sided film coating with the maximum area is facilitated; a film coating shielding area is reduced, and a substrate film coating invalid area is reduced; and the clamping design of springs and baffles facilitates the realization of automatic mass production operation.

Description

technical field [0001] The invention relates to the technical field of semiconductor device production, in particular to a substrate fixture for vertical double-sided coating. Background technique [0002] Solar energy is an inexhaustible renewable energy for human beings. It is also a clean energy source that does not produce any environmental pollution. Among the effective use of solar energy, solar photovoltaic utilization is the fastest growing and most dynamic research in recent years. field, is one of the most eye-catching projects. For this reason, people have developed and developed solar cells. In recent years, PERC solar cells have entered a bottleneck period of development. As new technologies, heterojunction solar cells and TOPCon solar cells have the potential to improve efficiency. big. [0003] Whether it is a conventional PERC battery, a TOPcon structure, or a HIT structure, a plasma coating process is required to prepare a thin film. At present, the convent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C16/458
CPCC23C14/50C23C16/4587
Inventor 杨星李长江周文彬
Owner SUZHOU SHENGCHENG SOLAR EQUIP
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