Wafer edge polishing equipment and method

An edge and wafer technology, applied in the field of wafer edge polishing equipment, can solve the problems of low manual cleaning efficiency, equipment output rate drop, and labor cost increase, so as to avoid damage and chuck contamination, reduce labor costs, The effect of improving cleanliness
CN112497046AInactive Publication Date: 2021-03-16ZING SEMICON CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ZING SEMICON CORP
Publication Date
2021-03-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides wafer edge polishing equipment and method. The equipment comprises a cavity, a sealing cover, a chuck, a carrying table, polishing pads, a cleaning device and a controller. Thesealing cover can move up and down to close or open the cavity; the chuck is located in the cavity and comprises a base and an annular side wall; the carrying table is located on the base; the polishing pads are located on the annular side wall of the chuck and distributed at the inner side of the annular side wall at intervals; the cleaning device comprises a nozzle and a cleaning pipeline, the nozzle is located in the cavity, one end of the cleaning pipeline is connected with a cleaning source, the other end of the cleaning pipeline is connected with the nozzle, and an automatic control valve is arranged on the cleaning pipeline; and the controller is connected with the automatic control valve and used for controlling the cleaning device to clean the chuck and the polishing pads after the edge polishing process is finished. By means of the wafer edge polishing equipment and method, particles in a polishing solution can be prevented from being accumulated on the equipment, damage to the polishing pads and pollution to the chuck are avoided, damage to wafers is avoided, the polishing yield and the equipment output rate can be increased, and the labor cost is reduced.
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Description

technical field

[0001] The invention relates to the technical field of wafer preparation, in particular to a wafer edge polishing device and method. Background technique

[0002] Bare wafer (bare wafer) is one of the most basic and important raw materials in the semiconductor chip manufacturing process. Its manufacturing process usually includes pulling polysilicon material into high-quality The crystal pulling step of the single crystal silicon rod, the division of the single crystal silicon rod into multi-segment single crystal silicon rods, the grinding of the outer diameter of the single crystal silicon rod and the rolling and segmentation step of processing the notch (notch) at the same time, the single crystal silicon rod A dicing step for dividing into wafers, a step for improving the flatness of the wafer surface by grinding, etc. are performed.

[0003] With the development of semiconductor manufacturing technology, the feature size of devices is shrinking and the ...

Claims

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