Manufacturing process of high-reliability heat-conducting adhesive tape for electronic component

Abstract

The invention discloses a manufacturing process of a high-reliability heat-conducting adhesive tape for an electronic component. The manufacturing process comprises the following steps: (1) preparinga base material layer; (2) coating an anti-static layer on the bonding surface of the base material layer, and drying; (3) coating the anti-static layer with the prepared adhesive solution containingthe adhesion promoter to obtain a thermal bonding layer, and uniformly paving a plurality of graphite particles on the surface of the thermal bonding layer; (4) pressing a plurality of graphite particles into the thermal bonding layer to form a plurality of grooves for accommodating the graphite particles on the surface of the thermal bonding layer, and drying; and (5) finally, pasting a release material layer on the surface of the thermal bonding layer to obtain the heat-conducting adhesive tape. The process mainly aims at the characteristic that heat and static electricity coexist in an electronic device, the manufactured adhesive tape can have excellent heat conductivity and excellent anti-static performance at the same time, the bonding strength of the contact strength of the adhesivetape and the electronic device can be kept for a long time, and the stability of the heat dissipation performance is achieved.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a manufacturing process for high-reliability thermally conductive adhesive tapes for electronic components. Background technique [0002] Existing electronic products often dissipate heat through fans, but due to their large size and noise, they are gradually eliminated by the market. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is not as good as expected. Slowly, people are looking for new and efficient heat dissipation materials. Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits the promotion of its application; Adhesive tapes that are thermally conductive and have antistatic properties have become the direction of efforts of those of...

AI Technical Summary

Problems solved by technology

[0002] Existing electronic products often use fans to dissipate heat, but due to their large size and noise, they are gradually eliminated by the market

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits the promotion of its application; Adhesive tapes that are thermally conductive and have antistatic properties have become the direction of efforts of ordinary skilled in the art