Manufacturing method of high-heat-dissipation laser device

A manufacturing method and technology of laser devices, which are applied to laser parts, lasers, semiconductor lasers, etc., can solve the problems of unsatisfactory overall heat dissipation performance of laser devices, and achieve the effects of easy implementation, precise welding operation, and simple manufacturing process

Active Publication Date: 2021-03-19
HGC (WUHAN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heat dissipation structure, packaging material selection and packaging manufacturing process of the existing laser devices make the overall heat dissipation performance of laser devices still difficult to meet the application in scenarios with higher heat dissipation requirements.

Method used

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  • Manufacturing method of high-heat-dissipation laser device
  • Manufacturing method of high-heat-dissipation laser device
  • Manufacturing method of high-heat-dissipation laser device

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Experimental program
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Embodiment Construction

[0042] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] see figure 1 as shown, figure 1 It is a schematic flowchart of a manufacturing method of a high heat dissipation laser device provided by an embodiment of the present invention. It should be noted that if there are substantially the same results, the method of the present invention is not based on figure 1 The flow sequence shown is limited. like figure 1 As shown, the manufacturing method of the high heat dissipation laser device comprises:

[0044]Step S101: making a substrate, the substrate has a first surface and a second surface opposite to the first surface, the substrate...

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Abstract

The invention relates to the field of laser devices, and provides a manufacturing method of a high-heat-dissipation laser device. The method comprises the following steps: manufacturing a substrate which is provided with at least one accommodating groove which is sunken from a first surface to a second surface and penetrates through the substrate; wherein the accommodating groove comprises a groove wall, one end of the groove wall is sunken to form a first positioning step, and the other end of the groove wall is sunken to form a second positioning step; providing a laser chip, welding the laser chip on the first positioning step, and enabling the light-emitting surface of the laser chip to face the second positioning step; manufacturing a metal radiator and welding the metal radiator, sothat one part of the structure of the radiator is welded on the non-light-emitting surface of the laser chip, and the other part of the structure of the metal radiator is welded on the first surface of the substrate; providing a lens, and fixing the lens on the second positioning step. By means of the mode, heat generated when the laser chip works can be directly transmitted to the substrate and outside air through the metal radiator, so that the heat is guided out in time, and the heat dissipation performance is improved.

Description

technical field [0001] The invention relates to the technical field of laser devices, and more specifically, to a method for manufacturing a high heat dissipation laser device. Background technique [0002] High-power semiconductor lasers have high output power and small light-emitting area, and they generate high heat density during operation. When the chip is overheated, the laser is quenched, which will limit the high-power laser output. Good device heat dissipation depends on optimized heat dissipation structure design, packaging material selection (thermal interface material and substrate material), and packaging manufacturing process. However, the current heat dissipation structure, packaging material selection and packaging manufacturing process of existing laser devices make it difficult for the overall heat dissipation performance of laser devices to be applied in scenarios with higher heat dissipation requirements. Contents of the invention [0003] The inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/0232H01S5/02345H01S5/024H01S5/026
CPCH01S5/02469H01S5/026
Inventor 李坤孙雷蒙杨丹
Owner HGC (WUHAN) TECH CO LTD
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