Circuit board soaking device and circuit board processing equipment

Abstract

The invention provides a circuit board soaking device and circuit board processing equipment. The circuit board soaking device comprises a soaking machine body, a rotating mechanism, a clamping mechanism and a vibrating mechanism, wherein the soaking machine body is provided with a soaking cavity; the rotating mechanism comprises a rotating seat and a rotating motor, the rotating seat is arrangedin the soaking cavity, and the rotating motor is connected with the rotating seat to enable the rotating seat to rotate; the clamping mechanism comprises a plurality of clamping parts, and the clamping parts are all connected with the rotating seat; the vibration mechanism comprises a vibration part and a vibration motor, the vibration part is arranged in the soaking cavity, and the vibration motor is connected with the vibration part. As the circuit board moves relative to the electroplating liquid in the soaking machine body, the electroplating liquid can continuously scour the circuit board, metal cations and an electroplating accelerator in the electroplating liquid can continuously scour into the blind holes of the circuit board, and the blind holes of the circuit board are fully infiltrated, so the quality of the circuit board is improved; concentration of metal cations and electroplating accelerators in the blind holes of the circuit board is increased, and then the subsequent blind hole electroplating filling effect is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing and processing, in particular to a circuit board soaking device and circuit board processing equipment. Background technique [0002] With the continuous improvement of the demand for electronic consumer goods, forcing the continuous innovation of PCB production technology and process, the second-order, third-order and higher-order high-density interconnection boards appear one after another. At present, the multi-level interconnected circuit board mainly adopts the blind hole stacking design, and the blind holes are plated and filled, which not only increases the conductivity and heat dissipation, but also simplifies the process. [0003] Before the electroplating process of electroplating and filling blind holes, the circuit board needs to be soaked, that is, the circuit board is immersed in an immersion solution with plating cations and electroplating accelerators to increas...

AI Technical Summary

Problems solved by technology

And because the aperture of the blind hole of circuit board is less, in soaking process, coating cation and electroplating accelerator are difficult to enter blind hole inside, therefore be difficult to make the coating cation concentration in blind hole and electroplating accelerator concentration reach preset value, and then It cannot improve the quality of blind hole filling

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