Manufacturing method for backboard and target material assembly

A manufacturing method and backplane technology, which are applied in the directions of manufacturing tools, milling machine equipment details, metal processing equipment, etc., can solve the problem that the performance of target components needs to be improved, and achieve the effect of improving forming quality, improving quality and high performance.

Inactive Publication Date: 2018-02-23
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the performance of the prior art target assembly needs to be improved

Method used

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  • Manufacturing method for backboard and target material assembly
  • Manufacturing method for backboard and target material assembly
  • Manufacturing method for backboard and target material assembly

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Experimental program
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Effect test

Embodiment Construction

[0027] It can be seen from the background art that in order to achieve good high-temperature deformation resistance of the backboard, the interior of the backboard adopts a water channel structure design. During the use of the target assembly, continuous cooling water flows into the water channel structure, thereby taking away a large amount of heat from the surface of the target assembly.

[0028] However, the quality of the back plate still needs to be improved. The reason is that currently the milling process is mainly used to form the water channel structure. During the milling process, cutting fluid is generally used to lubricate and cool. Since the cutting fluid is an oily solution, it is difficult to completely remove the cutting fluid after the waterway structure is formed, so there is likely to be cutting fluid residue in the waterway structure, resulting in poor surface finish and color of the waterway structure. Dullness, poor visual appearance and other problems, t...

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Abstract

The invention provides a manufacturing method for a backboard and a target material assembly. The manufacturing method includes the steps that a backboard blank material is provided, and comprises a welding face and a back face opposite to the welding face; the back face is subjected to rough machining, and an initial water channel is formed in the back face; the initial water channel is subjectedto finish machining to form a water channel structure; and in the finish machining process, an easy volatile solution is adopted to serve as cooling liquid. According to the manufacturing method forthe backboard, in the finish machining process on the initial water channel, the easy volatile solution is adopted to serve as the cooling liquid, the cooling liquid is not likely to form residues inthe water channel structure after volatizing of the cooling liquid, and therefore the surface cleanness degree and the luster degree of the water channel structure can be improved, remaining impurities in the water channel structure can be reduced or avoided, and therefore the forming quality of the water channel structure is improved, and therefore the quality of the backboard is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manufacturing method of a backplane and a target assembly. Background technique [0002] Sputtering technology is one of the commonly used processes in the field of semiconductor manufacturing. With the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering technology. The quality of sputtering targets directly affects the sputtering technology. Film quality after injection. [0003] In the field of sputtering target manufacturing, the target assembly is composed of a target blank that meets the sputtering performance and a back plate combined with the target blank. With the continuous upgrading of product technology, in order to achieve good high temperature deformation resistance of the back panel, the water channel structure design is adopted in the back panel. During the use of the target assembly, c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/00C23C14/34
CPCB23C3/00B23C2220/605C23C14/3407
Inventor 姚力军潘杰相原俊夫王学泽朱华海
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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