Circuit material and printed circuit board
A circuit and reinforcement material technology, which is applied in printed circuits, circuit substrate materials, printed circuit components, etc., can solve problems such as thickness uniformity, dielectric constant uniformity, and PIM problems in low frequency bands.
Active Publication Date: 2021-04-02
GUANGDONG SHENGYI SCI TECH
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- Application Information
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Problems solved by technology
Similarly, it is difficult for the resin composition to have both thickness uniformity and dielectric constant uniformity, and cannot solve the PIM problem in the low frequency band
Method used
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Effect test
Embodiment 1-10
[0072] Prepare the resin composition according to the components shown in Table 2 (the unit of raw material dosage is parts by weight), and make a copper-clad laminate sample according to the following production method:
[0073] (1) Dissolve and mix the components in the formula quantity into the reaction kettle, dilute with toluene to an appropriate viscosity, stir and mix evenly to obtain the resin glue.
[0074] (2) Soak the glass fiber cloth with the resin glue (the unit of the reinforcing material in Table 2 is the number of sheets), remove the solvent and bake to a semi-cured state, then stack multiple sheets, and press a copper foil on the top and bottom (Table 2 The unit of the conductive metal layer in 2 is the number of sheets), put it into a press for curing to obtain a copper clad laminate, the curing temperature is 240 °C, and the curing pressure is 50kg / cm 2 .
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Abstract
The invention relates to a circuit material and a printed circuit board. The circuit material comprises a dielectric substrate layer and conductive metal layers, wherein the conductive metal layers are laminated on one side or two sides of the dielectric substrate layer, and the rough surface roughness Rz of the conductive metal layers is less than or equal to 3 microns; and the dielectric substrate layer comprises a reinforcing material and a resin composition covering the reinforcing material. The resin composition comprises the following components: thermosetting resin with unsaturated double bonds, of which the number-average molecular weight Mn is less than or equal to 5000g / mol, thermosetting resin with unsaturated double bonds and number-average molecular weight Mn greater than or equal to 50000 g / mol, a spherical silica filler having a median particle diameter D50 of 2-5 [mu] m, a flame retardant, and a compound radical initiator. The circuit material provided by the inventioncan meet the requirements of a high-frequency electronic circuit substrate on comprehensive properties such as thickness uniformity, stable low dielectric constant, low dielectric loss, full-band lowPIM value, low insertion loss and the like.
Description
technical field [0001] The invention relates to the technical field of electronic materials, in particular to a circuit material and a printed circuit board. Background technique [0002] 5G communication technology is the fifth-generation system of mobile communication technology, which is oriented to the needs of mobile communication after 2020 and meets the development needs of mobile Internet and Internet of Everything business. Compared with 4G communication technology, 5G communication technology has faster information transmission rate, stronger spectrum utilization efficiency, lower delay, more reliable information transmission and higher link density, etc. In order to meet the design requirements of wireless communication products in the 5th generation communication era, the product design of multiple-input multiple-output (MIMO) antennas, active antennas, and multi-layer board antennas has become an inevitable trend in the 5G era. For antenna applications in 5G co...
Claims
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IPC IPC(8): C08L47/00C08L53/02C08L71/12C08L23/16C08K7/18C08K7/14C08K7/28C08K5/14C08K13/04B32B15/20B32B15/14B32B17/02B32B37/10B32B37/06H05K1/03
CPCC08L47/00C08L71/12B32B15/20B32B15/14B32B5/02B32B37/10B32B37/06H05K1/036C08L2205/03B32B2260/021B32B2262/101B32B2307/202B32B2457/08C08L53/02C08L9/00C08K7/18C08K7/14C08K7/28C08K5/14C08K13/04C08L23/16
Inventor 颜善银介星迪罗成郭浩勇许永静
Owner GUANGDONG SHENGYI SCI TECH
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