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High-performance conductive polyphenyl ether/polystyrene alloy material and preparation method and application thereof

A technology of polystyrene and alloy materials, applied in the field of polymer materials, can solve the problems of limited application of materials and unstable surface resistivity.

Active Publication Date: 2021-04-13
KINGFA SCI & TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the surface resistivity of existing conductive materials is not very stable, and is often affected by the temperature, injection speed and pressure during injection molding, which limits the application of materials

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0039] The preparation method of embodiment and comparative example:

[0040] According to the ratio in Table 1, mix the PPO resin and PS resin evenly and put them into the twin-screw extruder. The carbon fiber enters the twin-screw extruder through the first side feeding port, and the carbon fiber enters the twin-screw extruder through the second side feeding port. After extrusion, cooling, and granulation, high-performance conductive polyphenylene ether / polystyrene alloy materials are obtained; among them, the temperature of the barrel 1~12 of the twin-screw extruder is 200°C, 250°C, 270°C, 270°C ℃, 270℃, 270℃, 270℃, 270℃, 270℃, 270℃, 270℃, 270℃.

[0041] Relevant performance test methods or standards:

[0042] Dimensional shrinkage: refer to the standard ISO 2577-2007, and measure the dimensional shrinkage after baking at 120°C for 1 hour;

[0043] Surface resistivity: refer to standard ASTM D257-07;

[0044] Surface resistivity deviation: use 3mm injection molded square...

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Abstract

The invention discloses a high-performance conductive polyphenyl ether / polystyrene alloy material and a preparation method and application thereof. The high-performance conductive polyphenyl ether / polystyrene alloy material comprises the following components in parts by weight: 30-75 parts of PPO resin; 10-15 parts of PS resin; 5-15 parts of carbon fibers; and 5-25 parts of talcum powder. The carbon fibers and the talcum powder are added into the polyphenyl ether / polystyrene alloy, and throughsynergistic effect of the carbon fibers and the talcum powder, the conductive stability and the size stability of the material can be well improved, and the prepared high-performance conductive polyphenyl ether / polystyrene alloy material still has low surface resistivity and good size retention rate under the high-temperature condition, the problem of poor surface resistivity stability of the existing conductive material is solved, the application of the polyphenyl ether composite material is further broadened, and the high-performance conductive polyphenyl ether / polystyrene alloy material is particularly suitable for the field of electronic packaging.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a high-performance conductive polyphenylene ether / polystyrene alloy material and its preparation method and application. Background technique [0002] The PPO / PS alloy formed by blending polyphenylene oxide (PPO) and polystyrene (PS) has excellent mechanical properties and heat resistance, and is widely used in the field of electronic packaging (such as IC trays). In the IC chip packaging process, it is usually necessary to place the IC chip and the tray together in a high-temperature environment for baking to remove the moisture on the IC chip and fix the IC chip on the tray through high temperature, so the material is required to have better dimensional stability , can not be deformed after high-temperature baking; in addition, for IC trays, it is also required to have surface conductivity that does not short-circuit the IC chip and does not generate static electricity, that is...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L25/06C08K7/06C08K3/34C08K13/04
CPCC08L71/12C08K2201/004C08K2201/002C08K2201/001C08L2203/206C08L25/06C08K7/06C08K3/34C08K13/04
Inventor 刘文君黄险波叶南飚郑明嘉李名敏谭松
Owner KINGFA SCI & TECH CO LTD
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