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Microwave annealing modification method for gallium oxide material

A technology of microwave annealing and gallium oxide, which is applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as easy thermal diffusion, and achieve the effect of reducing the cost of annealing treatment, facilitating large-scale quantitative production and low cost.

Active Publication Date: 2021-04-13
GUANGHUA LINGANG ENG APPL & TECH R&D (SHANGHAI) CO LTD
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AI Technical Summary

Problems solved by technology

[0005] The invention provides a microwave annealing modification method for gallium oxide materials, which is used to solve the problem that thermal diffusion easily occurs during the annealing process of gallium oxide materials in the prior art, so as to improve the performance of the final semiconductor device , and reduce the annealing cost of gallium oxide materials

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  • Microwave annealing modification method for gallium oxide material
  • Microwave annealing modification method for gallium oxide material
  • Microwave annealing modification method for gallium oxide material

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Embodiment Construction

[0033] The specific implementation of the microwave annealing modification method for gallium oxide materials provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0034] This specific embodiment provides a microwave annealing modification method for gallium oxide materials, with figure 1 It is a flow chart of the microwave annealing modification method for gallium oxide materials in the specific embodiment of the present invention, with figure 2 is a schematic structural view of a substrate with a gallium oxide layer in a specific embodiment of the present invention. Such as figure 1 As shown, the microwave annealing modification method for gallium oxide materials described in this specific embodiment includes the following steps:

[0035] Step S11, providing a substrate 20, the surface of the substrate 20 has a gallium oxide layer 21, such as figure 2 shown.

[0036] In this specific implementation manner, ...

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Abstract

The invention relates to a microwave annealing modification method for a gallium oxide material. The microwave annealing modification method for the gallium oxide material comprises the following steps: providing a substrate, wherein the surface of the substrate is provided with a gallium oxide layer; and carrying out microwave annealing processing on the gallium oxide layer at a preset temperature, wherein the preset temperature is lower than a diffusion temperature, and the diffusion temperature is the lowest temperature at which thermal diffusion occurs between the gallium oxide material in the gallium oxide layer and the substrate. According to the invention, the problem that thermal diffusion between the gallium oxide layer and the substrate is likely to happen due to the fact that the annealing temperature is too high in the annealing process in an existing traditional annealing mode is solved, the microwave annealing cost is low, the annealing treatment cost of the gallium oxide material is reduced, and large-scale quantitative production is facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a microwave annealing modification method for gallium oxide materials. Background technique [0002] As a third-generation wide bandgap semiconductor material, gallium oxide has the advantages of larger forbidden band width and higher breakdown field strength. The ultra-wide band gap of gallium oxide material makes it have broad application prospects in the manufacture of high-power and high-frequency devices. [0003] Annealing is an important step in semiconductor process engineering for modifying material layers. Traditional annealing processes include tube furnace annealing, laser annealing and rapid thermal annealing (RTP). Among them, the tube furnace annealing method and the rapid thermal annealing method require high temperature during the annealing process, which is easy to induce the thermal diffusion effect, resulting in the diffusion between the ...

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Application Information

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IPC IPC(8): H01L21/477H01L21/02
CPCH01L21/477H01L21/02565H01L21/02664
Inventor 马宏平侯欣蓝
Owner GUANGHUA LINGANG ENG APPL & TECH R&D (SHANGHAI) CO LTD
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