Semiconductor device and manufacturing method thereof, integrated circuit and electronic equipment

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, circuits, etc., can solve problems such as high leakage current, insufficient on-state current, and increased power consumption of devices, and achieve low leakage current and steep sub-threshold Swing, high on-state current effect

Active Publication Date: 2021-04-13
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking semiconductor transistors as an example, conventional transistors often have problems such as insufficient on-state current and high leakage current, which increase the power consumption of the device, and these problems will become more serious as the degree of integration of the device increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device and manufacturing method thereof, integrated circuit and electronic equipment
  • Semiconductor device and manufacturing method thereof, integrated circuit and electronic equipment
  • Semiconductor device and manufacturing method thereof, integrated circuit and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0053] Various structural schematic diagrams according to embodiments of the present invention are shown in the drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity of presentation. The shapes of the various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art will Regions / layers with different shapes, sizes, and relative...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a semiconductor device and a manufacturing method thereof, an integrated circuit and electronic equipment. The semiconductor device may include, but is not limited to, a semiconductor substrate, a nanowire channel, a metal gate, a first epitaxial portion, a metal interposer, a second epitaxial portion, a gate, a source, a drain, etc. The nanowire channel is formed on the semiconductor substrate, and the metal gate is arranged around the nanowire channel in a surrounding manner. The first epitaxial portion is formed on the nanowire channel, the metal interposer is arranged around the first epitaxial portion in a surrounding mode, and the second epitaxial portion is arranged around the metal interposer in a surrounding mode. The gate is connected with the metal gate, the source is connected with the second epitaxial portion, and the drain is connected with the semiconductor substrate. The integrated circuit comprises the semiconductor device, and the electronic equipment comprises the semiconductor device or the integrated circuit. The invention can provide the semiconductor transistor with low sub-threshold swing and high switching current ratio, and the semiconductor transistor provided by the invention has the advantages of high on-state current, low leakage current, high integration level and the like.

Description

technical field [0001] The present invention relates to the technical field of semiconductor devices, and more specifically, the present invention can provide a semiconductor device, a manufacturing method thereof, an integrated circuit, and an electronic device. Background technique [0002] At present, semiconductor devices have been developing toward miniaturization and integration, which requires higher and higher performance of semiconductor devices. Taking semiconductor transistors as an example, conventional transistors often have problems such as insufficient on-state current and high leakage current, which increase the power consumption of the device, and these problems will become more serious as the degree of integration of the device increases. [0003] Therefore, there is an urgent need to provide a semiconductor transistor with higher on-state current and lower leakage current, so as to meet the needs of actual products. Contents of the invention [0004] In...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/06H01L29/423H01L21/336
CPCH01L29/78391H01L29/0607H01L29/0669H01L29/0684H01L29/42356H01L29/66477
Inventor 吴振华甘维卓张兆浩张永奎李俊杰殷华湘朱慧珑郭鸿
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products