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Enhanced flexible substrate surface magnetron sputtering winding coating equipment

A flexible substrate, magnetron sputtering technology, applied in the direction of sputtering coating, vacuum evaporation coating, ion implantation coating, etc. To achieve the effect of speeding up the efficiency of coating forming, preventing instability and accelerating efficiency

Pending Publication Date: 2021-04-16
YANCHENG INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some problems in the current coating device: 1. The tension of the substrate is not easy to adjust, and the surface flatness of the substrate is insufficient, resulting in the coating effect not reaching the expected effect; 2. The efficiency of forming after coating is low.

Method used

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  • Enhanced flexible substrate surface magnetron sputtering winding coating equipment
  • Enhanced flexible substrate surface magnetron sputtering winding coating equipment
  • Enhanced flexible substrate surface magnetron sputtering winding coating equipment

Examples

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Embodiment

[0026] An enhanced flexible substrate surface magnetron sputtering winding coating equipment, comprising a working room 1 and a connecting seat 20, the lower end of the working room 1 is fixedly connected with a support 2, and the working room 1 is rotatably connected with a stand A flat roller 3, the flattening roller 3 is wound with a substrate 4, two symmetrical rotating rollers 5 are rotatably connected to the working room 1, and the substrate 4 is contacted and connected to the rotating roller 5. The working room 1 is fixedly connected with four magnetron targets 6, and the magnetron target 6 is arranged on the outside of the rotating roller 5, and the working room 1 is rotatably connected with a winding roller 7, and the winding roller 7 is connected to the base material 4 contact, the inside of the working chamber 1 is provided with a chute 9, the inside of the chute 9 is slidably connected with a slider 10, the inside of the slider 10 is slidably connected with a fixed ...

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Abstract

The invention discloses enhanced flexible substrate surface magnetron sputtering winding coating equipment. The enhanced flexible substrate surface magnetron sputtering winding coating equipment comprises a working chamber and a connecting seat, a support is fixedly connected to the lower end of the working chamber, a flattening roller is rotatably connected to the working chamber, a substrate is connected to the flattening roller in a wound mode, two symmetrical rotating rollers are rotatably connected to the working chamber, the substrate is connected to the rotating rollers in a contact mode, four magnetic control targets are fixedly connected to the working chamber, the magnetic control targets are arranged on the outer side of the rotating rollers, a winding roller is rotatably connected to the working chamber and makes contact with the substrate, a sliding groove is formed in the working chamber, a sliding block is connected to the interior of the sliding groove in a sliding mode, and a fixed rod is slidably connected to the interior of the sliding block. The invention relates to enhanced flexible substrate surface magnetron sputtering winding coating equipment which has the characteristics of adjusting the tension degree of the substrate and accelerating the coating forming efficiency.

Description

technical field [0001] The invention belongs to the technical field of magnetron sputtering coating, in particular to an enhanced flexible substrate surface magnetron sputtering winding coating equipment. Background technique [0002] Magnetron sputtering is a type of physical vapor deposition (Physical Vapor Deposition, PVD). The general sputtering method can be used to prepare multiple materials such as metals, semiconductors, and insulators, and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetic sputtering is also required when coating the surface of an enhanced flexible substrate. Coating by controlled sputtering. However, there are some problems in the current coating device: 1. The tension of the substrate is not easy to adjust, and the surface flatness of the substrate is insufficient, resulting in the coating effect not reaching the expected effect; 2. The efficiency of forming after coating is low. Invention co...

Claims

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Application Information

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IPC IPC(8): C23C14/56C23C14/35
Inventor 孟灵灵黄新民严忠杰仲珍珍
Owner YANCHENG INST OF TECH
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