Sheet type electroplating clamp for lead frame and clamping method of sheet type electroplating clamp

Abstract

The invention discloses a sheet type electroplating clamp for a lead frame and a clamping method of the sheet type electroplating clamp. The sheet type electroplating clamp comprises a fixed bottom plate, wherein a charging conveying belt, an electroplating base, a discharging conveying belt and a machining frame are fixedly connected to the top of the fixed bottom plate, and clamping plates are movably connected to the top of the electroplating base. The invention relates to the technical field of machining for lead frames. According to the sheet type electroplating clamp for the lead frame and the clamping method of the sheet type electroplating clamp, expansion plates move downwards to extrude the clamping plates, the clamping plates drive balls to slide towards the two sides in the electroplating base, at the moment, return springs are extruded, inserting rods slide into inner cavities of fixing rods, the lead frame is placed in an electroplating tank, then suction discs cancel suction force, a first driving air cylinder ascends, and drives the suction discs to retract, at the moment, the clamping plates lose pushing of the expansion plates and move oppositely under pushing of the return springs, the clamping plates are clamped to the surface of the lead frame through the electroplating tank, and the lead frame is fixed, so that the lead frame can be rapidly fixed, and the sheet type electroplating clamp is convenient to operate and simple to use.

Description

technical field [0001] The invention relates to the technical field of lead frame processing, in particular to a sheet-type electroplating fixture for a lead frame and a clamping method thereof. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. Copper alloys for lead frames are roughly divided into copper-iron series, copper-nickel- Silicon, copper-chromium, copper-nickel-tin (JK--2 alloy), etc., ternary, quaternary and other multi-component copper alloys can achieve better performance and lowe...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a sheet-type electroplating fixture for a lead frame and its clamping method, which solves the problem that the lead frame cannot be fixed quickly due to the complexity of the fixing method for the lead frame

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