Manufacturing method of panel module

A production method and panel mold technology, applied in chemical instruments and methods, lamination auxiliary operations, synthetic resin layered products, etc., can solve the problem of low adhesion between liquid optical adhesive and substrate, enhanced peel strength, and prone to glue overflow, etc. problem, to avoid peeling phenomenon, improve adhesion, reduce glue overflow effect
CN112693210AActive Publication Date: 2021-04-23INTERFACE TECH CHENGDU CO LTD +3
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
INTERFACE TECH CHENGDU CO LTD
Publication Date
2021-04-23

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Abstract

The invention relates to a manufacturing method of a panel module. The manufacturing method of the panel module comprises the following steps of carrying out plasma cleaning treatment on a first base material, wherein the first base material is an organic base material, distributing an organic reagent on the first base material subjected to plasma cleaning treatment, meanwhile, enabling the area, to be coated with the liquid glue, of the first base material to be subjected to illumination treatment with the wavelength ranging from 100 nm to 500 nm, wherein the structure of the organic reagent contains double bonds and hydrophilic groups, coating the area to be coated with the liquid glue on the first base material with the liquid glue, and enabling a second base material to be attached to the liquid glue, and manufacturing the panel module. According to the manufacturing method of the panel module, excessive glue can be reduced, the adhesive force between the liquid glue and the first base material can be improved, and the phenomenon that the liquid glue is stripped from the first base material due to small adhesive force is avoided.
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Description

technical field

[0001] The invention relates to the field of liquid glue, in particular to a method for making a panel module. Background technique

[0002] In the full lamination process, whether it is a panel module or a touch module, liquid glue is often used to conform to the curved surface, but the current technical means are difficult to effectively control the flow of liquid glue, so the liquid glue is limited. Applications. At present, a bonding method of liquid glue is to use bumps, which can be bonded in the atmosphere, and because the height is lower than that of liquid glue, there will be no problem of not being able to discharge bubbles. However, in the current application of liquid glue, if the protrusion is used as a wall, due to the shape relationship of the buckle part of the substrate, the liquid glue is likely to flow to the buckle part due to capillary phenomenon, and glue overflow is prone to occur. In addition, when the substrate is a hydrophobic mate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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