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Manufacturing method of panel module

A production method and panel mold technology, applied in chemical instruments and methods, lamination auxiliary operations, synthetic resin layered products, etc., can solve the problem of low adhesion between liquid optical adhesive and substrate, enhanced peel strength, and prone to glue overflow, etc. problem, to avoid peeling phenomenon, improve adhesion, reduce glue overflow effect

Active Publication Date: 2021-04-23
INTERFACE TECH CHENGDU CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the current coating of liquid glue, if the protrusion is used as a wall, due to the shape relationship of the buckle part of the substrate, the liquid glue is easy to flow to the buckle part due to capillary phenomenon, and it is easy to overflow the glue
In addition, when the substrate is a hydrophobic material, the surface energy of the substrate is small, and the peel strength cannot be greatly enhanced by plasma treatment alone, so that the adhesion between the liquid optical adhesive and the substrate is small, and peeling is easy to occur after environmental testing

Method used

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  • Manufacturing method of panel module
  • Manufacturing method of panel module
  • Manufacturing method of panel module

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Embodiment Construction

[0027] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully in combination with specific embodiments. Preferred embodiments of the invention are given in the detailed description. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention.

[0029] see figure 1 , the manufacturing method of the panel module of an embo...

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Abstract

The invention relates to a manufacturing method of a panel module. The manufacturing method of the panel module comprises the following steps of carrying out plasma cleaning treatment on a first base material, wherein the first base material is an organic base material, distributing an organic reagent on the first base material subjected to plasma cleaning treatment, meanwhile, enabling the area, to be coated with the liquid glue, of the first base material to be subjected to illumination treatment with the wavelength ranging from 100 nm to 500 nm, wherein the structure of the organic reagent contains double bonds and hydrophilic groups, coating the area to be coated with the liquid glue on the first base material with the liquid glue, and enabling a second base material to be attached to the liquid glue, and manufacturing the panel module. According to the manufacturing method of the panel module, excessive glue can be reduced, the adhesive force between the liquid glue and the first base material can be improved, and the phenomenon that the liquid glue is stripped from the first base material due to small adhesive force is avoided.

Description

technical field [0001] The invention relates to the field of liquid glue, in particular to a method for making a panel module. Background technique [0002] In the full lamination process, whether it is a panel module or a touch module, liquid glue is often used to conform to the curved surface, but the current technical means are difficult to effectively control the flow of liquid glue, so the liquid glue is limited. Applications. At present, a bonding method of liquid glue is to use bumps, which can be bonded in the atmosphere, and because the height is lower than that of liquid glue, there will be no problem of not being able to discharge bubbles. However, in the current application of liquid glue, if the protrusion is used as a wall, due to the shape relationship of the buckle part of the substrate, the liquid glue is likely to flow to the buckle part due to capillary phenomenon, and glue overflow is prone to occur. In addition, when the substrate is a hydrophobic mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/00B32B27/30B32B27/36B32B27/32B32B27/08B32B27/06B32B7/12C08J7/12C08J7/18C08L33/12C08L67/02C08L69/00C08L45/00
CPCB32B37/12B32B38/0008B32B27/308B32B27/36B32B27/365B32B27/325B32B27/08B32B7/12C08J7/123C08J7/18C08J2333/12C08J2367/02C08J2369/00C08J2345/00
Inventor 罗俊译
Owner INTERFACE TECH CHENGDU CO LTD
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