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MEMS contact switch and preparation method thereof

A technology of contact switches and switch materials, which is applied in the manufacture of microstructure devices, gaseous chemical plating, televisions, etc., can solve problems such as switch failure, mechanical adhesion, and material wear, and achieve easy use, high contact reliability, and easy damage effect

Active Publication Date: 2021-04-30
NANJING GAOHUA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For contact switches, because the contact contacts are repeatedly impacted, material wear and mechanical adhesion are prone to occur, resulting in the failure of the switch

Method used

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  • MEMS contact switch and preparation method thereof
  • MEMS contact switch and preparation method thereof
  • MEMS contact switch and preparation method thereof

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0039] see figure 1 , the present invention proposes a MEMS contact switch, including stacked Peltier coolers and a switch structure formed above the coolers. specifically,

[0040] Peltier coolers include:

[0041] The first ceramic substrate 1;

[0042] A first electrode array 2, the first electrode array is arranged on the first ceramic substrate 1;

[0043] The thermocouple array 3 is arranged on the first electrode array 2; for example, the thermocouple array is formed by alternating arrangement of P-type doped bismuth telluride material and N-type doped bismuth telluride material.

[0044] A second electrode array 4, the second electrode array 4 is arranged on the thermocouple array 3;

[0045] A second ceramic substrate 5, the second ceramic substrate 5 is arranged on the second electrode array 4;

[0046] The switching material layer 6 is arranged on the upper surface of the Peltier cooler, that is, the upper surface of the second ceramic substrate 5; the switchin...

Embodiment 1

[0059] The present invention also proposes a method for making a MEMS contact switch for embodiment 1:

[0060] like figure 2 Shown: including the following steps:

[0061] S1: select the Peltier cooler as the substrate;

[0062] S2: preparing a switching material layer on the upper surface of the Peltier refrigerator;

[0063] S3: forming an electrode layer covering the switch material layer, and etching the electrode layer to form a transmission electrode layer and a capillary channel separating the transmission electrode layer;

[0064] S4: sealing and packaging the tube cap on the surface of the transmission electrode layer to form a closed cavity sealed with a certain amount of water vapor.

[0065] Specifically, a commercial Peltier refrigerator composed of a first ceramic substrate 1 , a first electrode array 2 , a thermocouple array 3 , a second electrode array 4 , and a second ceramic substrate 5 is selected as a substrate. The thermocouple array 3 of the Peltier...

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Abstract

The invention provides an MEMS contact switch and a preparation method thereof. The MEMS contact switch comprises: a Peltier refrigerator; a switch material layer which is arranged on the upper surface of the Peltier refrigerator; a transmission electrode layer which covers the Peltier refrigerator and the upper surface of the switch material layer; a capillary channel formed on the upper surface of the switch material layer and separating the transmission electrode layer; and a packaging pipe cap which covers the transmission electrode layer to form a closed cavity sealed with quantitative water vapor. According to the invention, the MEMS switch and the Peltier refrigerator are integrated. No movable mechanical part is arranged in the switch, and the problems of material abrasion and mechanical adhesion are solved. The switch is high in contact reliability, easy to use and not easy to damage.

Description

technical field [0001] The invention belongs to the field of microelectromechanical sensors, and in particular relates to a MEMS contact switch and a preparation method thereof. Background technique [0002] Electronic switches have a wide range of applications in electronics and communications. Compared with transistor switches, MEMS switches have low insertion loss, high isolation, and good linearity, so they have attracted more and more attention. [0003] Traditional MEMS switches are divided into two types: contact type and non-contact type, and the driving methods are usually electrostatic driving and thermal driving. In 1999, P. M. Zavracky (name) and others proposed an electrostatically driven MEMS contact switch, which has small size, low power consumption, small contact resistance, and the working frequency can reach 100kHz. In 2002, J.B. Rizk (name) and others proposed an electrostatically driven MEMS capacitive switch with an operating frequency of 0.5–6 GHz an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81C1/00047B81C1/00349
Inventor 李维平兰之康李军伟董旭光侯鸿道
Owner NANJING GAOHUA TECH
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