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Silver paste with high conductivity at low temperature and preparation method thereof

A high-conductivity, low-temperature technology, applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems such as poor conductivity, insufficient flexibility, and high hardness of conductive silver paste. The effect of increasing electrical conductivity, improving flexibility, and good bending resistance

Pending Publication Date: 2021-04-30
江苏碳导材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, under low temperature curing conditions, the crosslinking reaction is usually difficult to fully proceed, resulting in relatively high hardness of the cured conductive silver paste, insufficient flexibility and relatively poor conductivity under low temperature curing conditions

Method used

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  • Silver paste with high conductivity at low temperature and preparation method thereof
  • Silver paste with high conductivity at low temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The preparation method of silver paste in the following examples is:

[0032] Step 1: Prepare silver-plated copper powder by replacement reduction method to obtain material A;

[0033] Step 2: Prepare resin carrier: mix polyvinylidene fluoride resin with solvent, and dissolve completely at 60-65°C; then filter and remove impurities on a 1000-mesh screen, and adjust the viscosity of the resin carrier to 20000-28000 dpas ;

[0034] Step 3: Put the above-mentioned material A, resin carrier, silver oxalate, low-temperature curing agent and surfactant into a centrifuge for premixing to obtain material B, and then put the material B into an ultrasonic grinding device for grinding and dispersion, and Adjust its viscosity to 30000-40000 dpas to obtain the conductive silver paste.

Embodiment 1-3

[0035] Embodiment 1-3 and comparative example 1:

[0036] Embodiment 1, embodiment 2, embodiment 3 in table 1 are the resistivity situation of the conductive paste that uses the raw material of different weight parts to make; Wherein the difference of comparative example 1 and embodiment 3 is that do not add in the conductive silver paste Silver oxalate; the difference between comparative example 2 and embodiment 3 is that the silver-plated copper powder added is granular;

[0037] When testing the resistivity, print the silver paste on the surface of the PET substrate respectively, and print it into a resistance test block of 3 mm×35 mm, and test the corresponding resistance after baking at 100°C for 40 minutes, and convert it into resistivity;

[0038]

Embodiment 3-5

[0040]

[0041] Table 2 shows the resistivity of the conductive paste prepared using sodium dodecylbenzenesulfonate as a surfactant in Example 3, Example 4, and Example 5.

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Abstract

The invention discloses silver paste with high conductivity at a low temperature. The silver paste comprises the following components, by weight: 10-15 parts of silver oxalate, 50-70 parts of silver-plated copper powder, 30-40 parts of polyvinylidene fluoride resin, 20-25 parts of a solvent, 20-25 parts of a low-temperature curing agent, and 15-25 parts of a surfactant; according to the conductive silver paste, silver-plated copper powder serves as a main conductive phase and is in a dendritic shape, the dendritic shape is provided with a trunk and a plurality of branches separated from the trunk, more contact points exist between the trunk and the branches of the dendritic silver-plated copper powder in the curing process, and good conductive performance is formed; in addition, silver oxalate is added into the silver paste, the silver oxalate is decomposed along with rising of the temperature in the curing process, silver particles are generated, connection networks of original silver particles in the silver paste are increased through the newly-separated silver, and therefore the overall electrical conductivity is further improved.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to a silver paste with high conductivity at low temperature and a preparation method thereof. Background technique [0002] Conductive silver paste is mainly used for conductive and heat-conductive bonding in normal temperature curing welding occasions, such as quartz crystals, infrared pyroelectric detectors, piezoelectric ceramics, potentiometers, flash tubes, shielding, circuit repairs, etc., and can also be used for radio instruments and meters It can be used for conductive bonding in industry; it can also replace solder paste to achieve conductive bonding. [0003] Currently, under low-temperature curing conditions, the cross-linking reaction is usually difficult to fully proceed, resulting in relatively high hardness of the cured conductive silver paste, insufficient flexibility and relatively poor conductivity under low-temperature curing conditions. [0004] For this ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 张智萍袁海峰张俊元郭丹
Owner 江苏碳导材料科技有限公司