Silver paste sintered double-sided heat dissipation power module

Abstract

The invention discloses a silver paste sintered double-sided heat dissipation power module which comprises a power module body, and is characterized in that the power module body mainly comprises a first copper-clad ceramic substrate and a second copper-clad ceramic substrate which are oppositely arranged, and a power terminal, a control terminal and a chip which are arranged between the two copper-clad ceramic substrates; the power terminal and the control terminal are sintered on a conductive layer of the first copper-clad ceramic substrate or the second copper-clad ceramic substrate through a silver paste sintering layer; the back surface of the chip is sintered on the conductive copper layer of the first copper-clad ceramic substrate through a silver paste sintered layer, the front surface of the chip is sintered on a conductive connecting block through the silver paste sintered layer, and the conductive connecting block is sintered on the conductive copper layer of the second copper-clad ceramic substrate through the silver paste sintered layer; the chip is connected with the conductive copper layer of the first copper-clad ceramic substrate or the second copper-clad ceramic substrate through a metal wire, and a gap between the first copper-clad ceramic substrate and the second copper-clad ceramic substrate is electrically isolated through an epoxy plastic package body.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a silver paste sintered double-sided heat dissipation power module. Background technique [0002] A power module is a power drive device that combines power electronics and integrated circuit technology. Due to the advantages of high integration and high reliability, intelligent power modules are winning more and more markets, especially suitable for frequency converters and various inverter power supplies for driving motors, and are ideal for frequency control, metallurgical machinery, electric traction, servo Power electronic devices commonly used in driving and frequency conversion household appliances. With the continuous development of the new energy automobile industry, it is expected that SiC power chips will become more and more mature, and the existing module manufacturing process will not be able to meet the requirements of the structure and circuit reliabil...

AI Technical Summary

Problems solved by technology

With the continuous development of the new energy automobile industry, it is expected that SiC power chips will become more and more mature, and the existing module manufacturing process will not be able to meet the requirements of the structure and circuit reliability and integration of automotive modules dedicated to the automotive field in the future. requirements, we need power modules with higher operating temperature and reliability

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