Rapid post-heating molding device for semiconductor chip packaging

Abstract

The invention provides a rapid post-heating molding device for semiconductor chip packaging. An elastic frame is movably mounted on the inner upper wall of a molding bin below the bottom end of a bottom rod; a push plate is attached to the top end of the elastic frame; clamping strips are fixedly mounted on the upper surface of the push plate; a rotary table is arranged at the tail end of the push plate; protruding blocks corresponding to the clamping strips are arranged on the lower surface of the rotary table at equal intervals; a supporting table is fixedly installed at the position, below an air outflow head, of the top end of the rotary table; a sleeve rod is driven to swing up and down in the rotation process of an arc-shaped plate; after the sleeve rod extrudes the bottom rod, the bottom rod extrudes the elastic frame downwards; when the elastic frame pushes the clamping strips on the surface of the push plate to move inwards, the clamping strips are clamped between the adjacent protruding blocks at the bottom of the rotary table, the rotary table is driven to rotate by utilizing inclined surfaces at the inner ends of the clamping strips, and the rotary table drives the supporting table at the top end to rotate in sequence; and therefore, the quality defect caused by excessive heating of chips at the same position is avoided, each chip can be heated, and the molding speed can be increased conveniently.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a heated rapid prototyping device for semiconductor chip packaging. Background technique [0002] A semiconductor chip refers to a semiconductor device that is etched and wired on a semiconductor sheet to achieve a certain function. It is not just a silicon chip, but also semiconductor materials such as gallium arsenide and germanium. During processing, glue injection and encapsulation are required, and the surface of the encapsulated chip is easy to slip, so it needs to be quickly shaped. [0003] The chip after packaging cannot be rapidly prototyped, and there are certain limitations. At the same time, after the hot air continues to heat the same position, the surface quality of the chip is easily affected, and the chip contact molding speed cannot be adjusted according to the internal temperature, so , in view of this, the existing structure and d...

AI Technical Summary

Problems solved by technology

[0003] The chip after packaging cannot be rapidly prototyped, and there are certain limitations. At the same time, after the hot air continues to heat the same position, the surface quality of the chip is easily affected, and the chip contact molding speed cannot be adjusted according to the internal temperature, so , in view of this, research and improve the existing structure and defects, and provide a rapid prototyping device for semiconductor chip packaging after heating, in order to achieve the purpose of more practical value

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