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Manufacturing method of high-precision rigid-flex circuit board

A combination of soft and hard, manufacturing method technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve the problems of non-solderability of conductive lines, large chemical plating solution, complex process, etc.

Pending Publication Date: 2021-05-07
深圳市合成快捷电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional additive method generally uses silver paste or conductive ink as the component of the conductive pattern. However, the cost of silver paste or conductive ink silver paste is high, which makes the cost of the additive method also high.
Moreover, the conductive pattern formed by silver paste or conductive ink can no longer be soldered to electronic devices, making the conductive circuit formed by the additive method non-solderable
Although the conductive lines formed by electroless copper plating can solder electronic devices, this method will use a large amount of electroless plating solution that pollutes the environment, and the process of this method is more complicated. Therefore, we propose a high-precision soft-hard combination The production method of the circuit board to solve the above problems

Method used

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  • Manufacturing method of high-precision rigid-flex circuit board

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] Below, in conjunction with accompanying drawing and specific embodiment, the present invention is further described:

[0028] see figure 1 , according to a method for manufacturing a high-precision soft-rigid circuit board according to an embodiment of the present invention, the specific method is as follows:

[0029] S1: Substrate production: The FPC board and PCB board are seamlessly pressed together by a pressing machine to make a flexible and rigid...

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Abstract

The invention discloses a manufacturing method of a high-precision rigid-flex circuit board, and particularly relates to the technical field of wireless signal control of wireless routers. The specific method comprises the steps of S1, manufacturing a substrate, specifically, carrying out seamless pressing on an FPC board and a PCB through a pressing machine, and manufacturing a base board of the rigid-flex board; S2, conducting punching, specifically, punching the positions, where holes need to be reserved, of the base board through a punching machine; and S3, carrying out metal plating treatment, specifically, carrying out first-time metal plating treatment in the hole, forming an initial metal layer on the inner wall of the hole, then carrying out second-time metal plating treatment, forming a main body metal layer on the initial metal layer, and forming a conductive layer by the initial metal layer and the main body metal layer. The printed circuit board is simple in process and low in cost, the high-precision rigid-flex circuit board can be used in some products with special requirements, has a certain flexible area and a certain rigid area, and can save the internal space of the product, reduce the volume of the finished product and improve the performance of the product.

Description

technical field [0001] The invention relates to the technical field of manufacturing a composite circuit board, more specifically, the invention relates to a method for manufacturing a high-precision soft-hard combination circuit board. Background technique [0002] Circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCB, ultra-thin circuit boards, ultra-thin circuits boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, and the FPC circuit board (FPC circuit board is also called a flexible circuit board). , an excellent flex...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/12H05K3/34H05K1/09
CPCH05K3/4691H05K3/12H05K3/1283H05K3/34H05K1/092
Inventor 雷成
Owner 深圳市合成快捷电子科技有限公司
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