[0026]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.
[0027]Next, a further description of the present invention will be made in conjunction with the accompanying drawings and specific embodiments:
[0028]Seefigure 1, A method of fabricating a high precision soft hard bonding circuit board according to an embodiment of the present invention, and the specific method is as follows:
[0029]S1: Substrate Production: The FPC plate and the PCB plate are seamlessly pressed by the pressing machine to make a soft and hard bond sheet substrate;
[0030]S2: Punch: Use the chiseling machine to punch the bore on the substrate;
[0031]S3: Plating metal plating: The first plating metal layer is performed in the hole, and the initial metal layer is formed in the inner wall of the hole, and then the second plating metal layer is carried out, and the main metal layer, the initial metal layer, and the main body metal are formed on the initial metal layer. Layer constitutes a conductive layer;
[0032]S4: Printing Line: Printing the conductive adhesive on the substrate and prints back to the printing of 2-5 times, and the printing substrate is allowed to stand for 10-20 minutes in the air, and the conductive glue is dried to form a printed line;
[0033]S5: After the printing line: flatten the printed line, and the soldering ink is printed on the printed line;
[0034]S6: Component Installation: Two or more pins are introduced from the back of the substrate, and then weld the components onto the substrate using the welding tool;
[0035]S7: Test: After the welding work is completed, a comprehensive test work is performed on the entire circuit board;
[0036]S8: Package: Subsequent package packages for circuit boards.
[0037]Further, the initial metal layer has a thickness of from 1 to 10 microns, and the thickness of the body metal layer is 30-50 microns.
[0038]Further, the conductive glue includes a resin matrix and a first conductive particles mixed in the resin matrix to the second conductive particles.
[0039]Further, the first conductive particles are tin powder particles, the second conductive particles as one or more of silver powder, copper powder, nickel powder, graphite.
[0040]Further, the conductive glue produces the number of raw materials: 7-10 parts of the resin matrix, 3-5 parts of the curing agent, 45-80 parts of the first conductive particles, and 5-10 parts of the second conductive particles.
[0041]Further, the conductive glue produces the material mass of the material: 7 parts of the resin matrix, 3 parts of the curing agent, 45 parts of the first conductive particles, and 5 parts of the second conductive particles.
[0042]Further, the conductive glue produces the material mass of the raw material: 10 parts of the resin matrix, 5 parts of the curing agent, 80 parts of the first conductive particles, and 10 second conductive particles.
[0043]Further, the conductive glue produces the material mass of the raw material: 8 parts of the resin matrix, 4 parts of the curing agent, 65 parts of the first conductive particles, and 8 parts of the second conductive particles.
[0044]Further, the printing step is performed by spraying, roller coating, screen printing, gravure printing, glue printing, flexographic printing, dripping, rotary screen printing or ink jet printing.
[0045]In order to facilitate the understanding of the above technical solution of the present invention, the flow of the above-mentioned scheme of the present invention will be described in detail below with reference to the accompanying drawings.
[0046]According to an embodiment of the invention, a method of fabricating a high precision soft bonding circuit board is provided.
[0047]Such asfigure 1As shown, in the actual production process, a high-precision soft hard-binding circuit board is made, including the following steps:
[0048]Step S101: Substrate production: The FPC plate and the PCB plate are seamlessly pressed by the pressing machine, and form a soft and hard bond sheet substrate;
[0049]Step S103: Punch: Use a chiseling machine to punch a hole on the substrate;
[0050]Step S105: Plating metal plating: The first plating metal treatment is performed in the hole, and the initial metal layer is formed in the inner wall of the hole, and then the second plating metal layer is performed on the initial metal layer, the initial metal layer and the main body. The metal layer constitutes a conductive layer;
[0051]Step S107: Printing line: Printing the conductive adhesive on the substrate and prints back to the printing of 2-5 times, the printing substrate is allowed to stand in the air for 10-20 minutes, and the conductive glue is dried to form a printed line. ;
[0052]Step S109: Post processing of the printed line: flat press the printed line, and printing the solder ink on the printed line;
[0053]Step S111: Component mounting: Two or more pins are introduced from the back of the substrate, and then weld the components to the substrate using the welding tool;
[0054]Step S113: Detection: After the welding work is completed, a comprehensive testing of the entire circuit board is performed;
[0055]Step S115: Package: Subsequent package packages for the board.
[0056]The principle of work of the present invention: The method of producing a high-precision soft and hard bonding circuit board provided, by printing a conductive glue on the substrate and the conductive glue comprises a resin matrix and a first conductive particle mixed in a resin matrix, the first conductive particles is Tin powder particles, and dry curing treatment for conductive glue to form printed lines, since the conductive gum contains tin powder particles, and tin powder particles have a highly melting point and weldability characteristics, thereby enabling the formed conductive line formed It can be firmly printed on the substrate, and can be welded to the electronic device, and the printing, roller coating, screen printing, gravure printing, glue printing, flexographic printing, dripping, rotary screen printing or inkjet printing and curing process is formed. The conductive line makes the process simple, low cost, and high-precision soft binding circuit board can be used in some special requirements, and there is a certain flexible area, and there is a certain rigid area. Save the internal space of the product, reduce the volume of finished product, and improve product performance.
[0057]In the end, it is: First, in the description of the present application, it is necessary to explain that the term "installation", "connected", "connection" should be used unless otherwise specified and defined, and "connect" should be a mechanical connection. Or electrically connect, or in communication inside the two components, "" upper "," down "," left "," right "or the like can only be used to represent a relative positional relationship, when the absolute position of the object Change, the relative positional relationship may change;
[0058]Second: The present invention discloses the figures of the present invention, and only the structure according to the present disclosure, other structures can be referred to usual design, in the case of unlimited cases, the same embodiments and different embodiments of the invention may be combined with each other;
[0059]Finally: Top preferred embodiments are preferred embodiments, are not intended to limit the invention, and any modifications, equivalents, improvements, etc., which are in the present invention. Within the protection range.
