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PCB selective gold plating process

A PCB board, selective technology, applied in the direction of circuit cover, electrical components, printed circuits, etc., can solve the problems of gold consumption, increase production cost, precious metal waste, etc., and achieve the effect of reducing production cost, reducing waste, and reducing oxidation risk.

Inactive Publication Date: 2021-05-14
中山市宝悦嘉电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the traditional electro-gold process of printed circuit boards, all conductive patterns need to be plated with gold, so a large amount of gold is consumed, and gold-plated parts that do not need to be soldered will not only lead to waste of precious metals, but also greatly increase the production of enterprises. cost

Method used

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  • PCB selective gold plating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] A kind of PCB board selective electro-gold process, concrete steps are as follows:

[0060] (1) Cutting, drilling, sinking copper, board electricity, dry film of the primary circuit: cutting and drilling the PCB board, and then carrying out copper sinking and full board electroplating; attaching a layer of dry film on the PCB board, Expose and develop the film-attached PCB board, remove the uncured dry film, and then perform micro-etching after degreasing. The above operations are carried out according to the conventional process of the PCB board.

[0061] (2) One-time copper / nickel electroplating and drying: pickle the PCB board after micro-etching, then electroplate copper and nickel in turn, and then remove the board and dry the board.

[0062] The copper electroplating condition is 20ASF×25 minutes, and the nickel electroplating condition is 16ASF×20 minutes.

[0063] (3) Wet film printing and baking board: In the text process, wet film screen printing is performe...

Embodiment 2

[0075] A kind of PCB board selective electro-gold process, concrete steps are as follows:

[0076] (1) Cutting, drilling, sinking copper, board electricity, dry film of the primary circuit: cutting and drilling the PCB board, and then carrying out copper sinking and full board electroplating; attaching a layer of dry film on the PCB board, Expose and develop the film-attached PCB board, remove the uncured dry film, and then perform micro-etching after degreasing. The above operations are carried out according to the conventional process of the PCB board.

[0077] (2) One-time copper / nickel electroplating and drying: pickle the PCB board after micro-etching, then electroplate copper and nickel in turn, and then remove the board and dry the board.

[0078] The copper electroplating condition is 24ASF×25 minutes, and the nickel electroplating condition is 18ASF×20 minutes.

[0079] (3) Wet film printing and baking board: In the text process, wet film screen printing is performe...

Embodiment 3

[0091] A kind of PCB board selective electro-gold process, concrete steps are as follows:

[0092] (1) Cutting, drilling, sinking copper, board electricity, dry film of the primary circuit: cutting and drilling the PCB board, and then carrying out copper sinking and full board electroplating; attaching a layer of dry film on the PCB board, Expose and develop the film-attached PCB board, remove the uncured dry film, and then perform micro-etching after degreasing. The above operations are carried out according to the conventional process of the PCB board.

[0093] (2) One-time copper / nickel electroplating and drying: pickle the PCB board after micro-etching, then electroplate copper and nickel in turn, and then remove the board and dry the board.

[0094] The copper electroplating condition is 22ASF×25 minutes, and the nickel electroplating condition is 17ASF×20 minutes.

[0095] (3) Wet film printing and baking board: In the text process, wet film screen printing is performe...

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Abstract

The invention belongs to the technical field of printed circuit board preparation, and particularly discloses a PCB selective gold plating process. The selective gold plating process comprises the following steps that cutting, drilling, copper deposition and full-board electroplating are carried out on a PCB; a layer of dry film is attached to the PCB, the PCB with the attached film is exposed and developed, the uncured dry film is removed, and then micro-etching is carried out after oil removal; acid pickling is carried out on the PCB after micro-etching is completed, then copper / nickel is electroplated, the PCB is unloaded, and the PCB is dried; wet film screen printing is performed on the PCB in the character process, and then the PCB is baked; and the PCB is subjected to citric acid washing and water washing, then electrogilding is carried out, and finally film stripping and etching are carried out. According to the process, the part, which does not need to be welded, of the PCB is not plated with gold, so that the waste of noble metal can be reduced, and the production cost of enterprises is reduced; meanwhile, in the etching process, special liquid medicine is adopted for management and control, the main components of the liquid medicine are NH4Cl, NH3.H2O and CuCl2, the content of Cu<2+> in the liquid medicine is 130-150 g / L, the content of Cl<-> in the liquid medicine is 165-175 g / L, the pH value is 8.0-8.5, and the oxidation risk can be reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board preparation, in particular to a selective electro-gold process for PCB boards. Background technique [0002] PCB board, also known as printed circuit board or printed circuit board, is the provider of electrical connections for electronic components. Its development has a history of more than 100 years. The design is mainly layout design. The main advantage of using circuit boards is to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate. Due to the increase in the packaging density of integrated circuits, resulting in a high concentration of interconnection lines, the use of double-sided boards or even multi-layer boards has become necessary. In order to realize the electrical connection between multi-layer boards, drilling must be carried out. Metal copper has good electrical conductivity, thermal conductivity, low resistivity, hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/22H05K3/26
CPCH05K3/00H05K3/0082H05K3/027H05K3/22H05K3/26
Inventor 董延卫
Owner 中山市宝悦嘉电子有限公司
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