Metal layer-including carbonaceous member and heat conduction plate
A metal layer and metal coating technology, which is applied in the direction of metal layered products, metal material coating process, superimposed layer plating, etc., can solve the problems of low thermal conductivity of titanium and inability to transfer heat, and achieve effective conduction and effective heat transfer. Effect
Active Publication Date: 2021-05-25
MITSUBISHI MATERIALS CORP
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Problems solved by technology
[0012]However, due to the relatively low thermal conductivity of titanium, which is 17W / (m·K), the titanium layer between the carbonaceous member and the metal layer becomes a thermal Even if the carbonaceous member is arranged so that the base surface of the graphene extends in the thickness direction of the heat conduction plate, heat may not be effectively transferred to the thickness direction.
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Embodiment
[0109] Confirmation experiments performed to confirm the effectiveness of the present invention will be described.
[0110] [Experiment 1]
[0111] As disclosed in the present embodiment, a molded body is obtained by blending flat graphite particles and graphene aggregates in a predetermined mixing ratio, and molding under pressure and heating. The structure is the flat graphite The particles are layered on top of each other with graphene aggregates as a binder.
[0112] The average particle diameter observed from the basal surface of the graphite particles was 100 μm as measured by the line segment method. The average thickness of the graphite particles was 3 μm as measured by the line segment method. As a result of confirmation within the field of view of an electron microscope, the graphene aggregates have an average of 10 layers. The average particle size of the graphene aggregates measured by the line segment method is 5 μm, and the average thickness of the graphene ag...
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Abstract
A carbonaceous member (21) includes a graphene aggregate which is formed by depositing single-layer or multiple-layer graphene, and flat graphite particles, and is structured such that the flat graphite particles are laminated with the graphene aggregate as a binder so as to have the basal surfaces thereof folded, and the basal surfaces of the flat graphite particles are aligned in one direction. A metal layer (25) is provided with a metal plating layer (26) directly formed on a surface (edge laminated surface) to which the edge surface of the laminated graphite particles is directed in the carbonaceous member (21). The metal plating layer (26) is made of a metal having heat conductivity of 50 W / (m.K) or greater.
Description
technical field [0001] The present invention relates to, for example, a carbonaceous member with a metal layer that can effectively transfer the heat dissipated by a heating element, and is particularly suitable as a heat conduction member, and a heat conduction plate composed of the carbonaceous member with a metal layer. [0002] This application claims priority based on Patent Application No. 2018-206000 filed in Japan on October 31, 2018, and uses the content thereof here. Background technique [0003] Various devices equipped with heating elements (power semiconductor elements and LED elements), such as power modules and LED modules, are equipped with heat sinks to effectively dissipate the heat generated by the heating elements. Between (the element and the substrate on which the element is mounted, etc.) and the heat sink, for example, a heat conduction plate disclosed in Patent Documents 1 to 3 may be arranged. [0004] Patent Document 1 discloses a power module inc...
Claims
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Login to View More IPC IPC(8): B32B9/00H01L23/36
CPCH01L2224/32225H01L23/42H01L23/3736H01L23/373H01L23/3735B32B7/12B32B2250/40B32B2255/28B32B2255/04B32B15/16B32B2457/00B32B2255/20B32B2307/732B32B2255/205B32B2264/108B32B2307/302B32B15/20B32B2307/538B32B5/16B32B2250/03H01L2224/29101H01L2224/83801H01L24/29H01L24/32H01L24/83H01L2224/29111H01L2924/014H01L2924/00014H01L24/36B32B9/007B32B9/041C23C28/34H05K7/20509
Inventor 喜多晃一长瀬敏之中矢清隆岩田广太郎
Owner MITSUBISHI MATERIALS CORP